Part Details for CY7C1570KV18-400BZXC by Infineon Technologies AG
Overview of CY7C1570KV18-400BZXC by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Price & Stock for CY7C1570KV18-400BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2015-CY7C1570KV18-400BZXC-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray |
221 In Stock |
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$72.9500 | Buy Now |
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DISTI #
CY7C1570KV18-400BZXC-ND
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DigiKey | IC SRAM 72MBIT PARALLEL 165FBGA Min Qty: 1 Lead time: 11 Weeks Container: Tray | Limited Supply - Call |
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$186.9006 | Buy Now |
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DISTI #
CY7C1570KV18-400BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Trays (Alt: CY7C1570KV18-400BZ) RoHS: Compliant Min Qty: 272 Package Multiple: 136 Lead time: 11 Weeks, 0 Days Container: Tray | 0 |
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$196.3500 / $238.4250 | Buy Now |
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DISTI #
CY7C1570KV18-400BZ
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Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA (Alt: CY7C1570KV18-400BZ) RoHS: Compliant Min Qty: 5 Package Multiple: 1 Lead time: 0 Weeks, 2 Days | 0 |
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$132.8040 / $160.6500 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: No Min Qty: 272 Package Multiple: 272 Lead time: 11 Weeks Container: Tray | 0Tray |
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$175.3200 | Buy Now |
Part Details for CY7C1570KV18-400BZXC
CY7C1570KV18-400BZXC CAD Models
CY7C1570KV18-400BZXC Part Data Attributes
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CY7C1570KV18-400BZXC
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CY7C1570KV18-400BZXC
Infineon Technologies AG
DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | Infineon | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | DDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.32 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.75 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 13 mm |
Alternate Parts for CY7C1570KV18-400BZXC
This table gives cross-reference parts and alternative options found for CY7C1570KV18-400BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1570KV18-400BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8672T38AE-400T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1570KV18-400BZXC vs GS8672T38AE-400T |
| CY7C1570KV18-400BZI | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1570KV18-400BZXC vs CY7C1570KV18-400BZI |
| GS8672T38AE-400 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | CY7C1570KV18-400BZXC vs GS8672T38AE-400 |
| CY7C1570KV18-400BZXC | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | CY7C1570KV18-400BZXC vs CY7C1570KV18-400BZXC |