There are no models available for this part yet.
Overview of CY7C1612KV18-333BZC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 3 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for CY7C1612KV18-333BZC by Cypress Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
89T5370
|
Newark | Sync Srams/Tray |Cypress Infineon Technologies CY7C1612KV18-333BZC RoHS: Not Compliant Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now |
CAD Models for CY7C1612KV18-333BZC by Cypress Semiconductor
Part Data Attributes for CY7C1612KV18-333BZC by Cypress Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Transferred
|
Ihs Manufacturer
|
CYPRESS SEMICONDUCTOR CORP
|
Part Package Code
|
BGA
|
Package Description
|
FBGA-165
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
Clock Frequency-Max (fCLK)
|
333 MHz
|
I/O Type
|
SEPARATE
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e0
|
Length
|
17 mm
|
Memory Density
|
150994944 bit
|
Memory IC Type
|
QDR II SRAM
|
Memory Width
|
18
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
165
|
Number of Words
|
8388608 words
|
Number of Words Code
|
8000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
8MX18
|
Output Characteristics
|
3-STATE
|
Output Enable
|
NO
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA165,11X15,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Peak Reflow Temperature (Cel)
|
260
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Current-Max
|
0.41 A
|
Standby Voltage-Min
|
1.7 V
|
Supply Current-Max
|
0.97 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
15 mm
|
Alternate Parts for CY7C1612KV18-333BZC
This table gives cross-reference parts and alternative options found for CY7C1612KV18-333BZC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1612KV18-333BZC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C1612KV18-333BZI | QDR SRAM, 8MX18, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, FBGA-165 | Cypress Semiconductor | CY7C1612KV18-333BZC vs CY7C1612KV18-333BZI |
CY7C1612KV18-333BZC | QDR II SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C1612KV18-333BZC vs CY7C1612KV18-333BZC |
CY7C1612KV18-333BZXC | QDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | CY7C1612KV18-333BZC vs CY7C1612KV18-333BZXC |
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