There are no models available for this part yet.
Overview of CY7C1618KV18-300BZXC by Infineon Technologies AG
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Price & Stock for CY7C1618KV18-300BZXC by Infineon Technologies AG
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
| Future Electronics | RoHS: Compliant pbFree: No Min Qty: 525 Package Multiple: 525 Lead time: 11 Weeks | 0 |
|
$237.3300 | Buy Now | ||
|
DISTI #
SP005660743
|
EBV Elektronik | (Alt: SP005660743) RoHS: Compliant Min Qty: 525 Package Multiple: 525 Lead time: 12 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
CAD Models for CY7C1618KV18-300BZXC by Infineon Technologies AG
Part Data Attributes for CY7C1618KV18-300BZXC by Infineon Technologies AG
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|
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|---|---|
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Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
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Ihs Manufacturer
|
INFINEON TECHNOLOGIES AG
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|
Package Description
|
FBGA-165
|
|
Reach Compliance Code
|
compliant
|
|
Samacsys Manufacturer
|
Infineon
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Access Time-Max
|
0.45 ns
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Additional Feature
|
PIPELINED ARCHITECTURE
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Clock Frequency-Max (fCLK)
|
300 MHz
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I/O Type
|
COMMON
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JESD-30 Code
|
R-PBGA-B165
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|
JESD-609 Code
|
e1
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Length
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17 mm
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Memory Density
|
150994944 bit
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Memory IC Type
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DDR SRAM
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Memory Width
|
18
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Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Terminals
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165
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Number of Words
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8388608 words
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Number of Words Code
|
8000000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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|
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Organization
|
8MX18
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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LBGA
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Package Equivalence Code
|
BGA165,11X15,40
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Package Shape
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RECTANGULAR
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Package Style
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GRID ARRAY, LOW PROFILE
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
|
260
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Qualification Status
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Not Qualified
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Seated Height-Max
|
1.4 mm
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Standby Current-Max
|
0.39 A
|
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Standby Voltage-Min
|
1.7 V
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Supply Current-Max
|
0.61 mA
|
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Supply Voltage-Max (Vsup)
|
1.9 V
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Supply Voltage-Min (Vsup)
|
1.7 V
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Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
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Terminal Form
|
BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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15 mm
|