Part Details for CY7C2268XV18-600BZXC by Cypress Semiconductor
Overview of CY7C2268XV18-600BZXC by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for CY7C2268XV18-600BZXC
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
05W7491
|
Newark | Sync Srams/Tray |Cypress Infineon Technologies CY7C2268XV18-600BZXC RoHS: Not Compliant Min Qty: 680 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
Buy Now | |
DISTI #
2156-CY7C2268XV18-600BZXC-ND
|
DigiKey | IC SRAM 36MBIT PAR 165FBGA Min Qty: 3 Container: Bulk MARKETPLACE PRODUCT |
248 In Stock |
|
$110.9100 | Buy Now |
|
Rochester Electronics | CY7C2268XV18 - DDR SRAM, 2MX18, 0.45ns PBGA165 ' RoHS: Compliant Status: Active Min Qty: 1 | 248 |
|
$95.1800 / $111.9700 | Buy Now |
Part Details for CY7C2268XV18-600BZXC
CY7C2268XV18-600BZXC CAD Models
CY7C2268XV18-600BZXC Part Data Attributes
|
CY7C2268XV18-600BZXC
Cypress Semiconductor
Buy Now
Datasheet
|
Compare Parts:
CY7C2268XV18-600BZXC
Cypress Semiconductor
DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | BGA | |
Package Description | FBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 600 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 37748736 bit | |
Memory IC Type | DDR SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX18 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Current-Max | 0.91 A | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.91 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 13 mm |
Alternate Parts for CY7C2268XV18-600BZXC
This table gives cross-reference parts and alternative options found for CY7C2268XV18-600BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C2268XV18-600BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C2268XV18-600BZXC | DDR SRAM, 2MX18, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | CY7C2268XV18-600BZXC vs CY7C2268XV18-600BZXC |