Datasheets
CY7C245A-18WMB by:

UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMATIC SEALED, CERDIP-24

Part Details for CY7C245A-18WMB by Cypress Semiconductor

Overview of CY7C245A-18WMB by Cypress Semiconductor

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for CY7C245A-18WMB

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CY7C245A-18WMB Part Data Attributes

CY7C245A-18WMB Cypress Semiconductor
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CY7C245A-18WMB Cypress Semiconductor UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, HERMATIC SEALED, CERDIP-24
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description 0.300 INCH, WINDOWED, HERMATIC SEALED, CERDIP-24
Pin Count 24
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 12 ns
Additional Feature PROGRAMMABLE SYNCHRONOUS OR ASYNCHRONOUS OUTPUT ENABLE; PROGRAMMABLE ASYNCHRONOUS REGISTERS
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.877 mm
Memory Density 16384 bit
Memory IC Type UVPROM
Memory Width 8
Moisture Sensitivity Level 1
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Programming Voltage 12.5 V
Qualification Status Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.08 mm
Standby Current-Max 0.12 A
Supply Current-Max 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for CY7C245A-18WMB

This table gives cross-reference parts and alternative options found for CY7C245A-18WMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C245A-18WMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
QP7C292A-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor CY7C245A-18WMB vs QP7C292A-35WC
TMS27C291-3JL 2KX8 UVPROM, 35ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Texas Instruments CY7C245A-18WMB vs TMS27C291-3JL
5962-8765003LA UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8765003LA
CY7C245A-18WI UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, SLIM, CERDIP-24 Cypress Semiconductor CY7C245A-18WMB vs CY7C245A-18WI
CY7C245A-18WC UVPROM, 2KX8, 12ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor CY7C245A-18WMB vs CY7C245A-18WC
QP7C292A-35WMB UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 Teledyne e2v CY7C245A-18WMB vs QP7C292A-35WMB
5962-8981503LB UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8981503LB
WS57C291C-35T UVPROM, 2KX8, 35ns, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Teledyne e2v CY7C245A-18WMB vs WS57C291C-35T
QP7C291AL-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor CY7C245A-18WMB vs QP7C291AL-35WC
5962-8981501LA UVPROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8981501LA
Part Number Description Manufacturer Compare
QP7C292A-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 QP Semiconductor CY7C245A-18WMB vs QP7C292A-35WC
5962-8873504LX OTP ROM, 2KX8, 15ns, CMOS, CDIP24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8873504LX
5962-8752902LX UVPROM, 2KX8, 35ns, CMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v CY7C245A-18WMB vs 5962-8752902LX
5962-8873503LX OTP ROM, 2KX8, 15ns, CMOS, CDIP24, CERAMIC, DIP-24 Waferscale Integration Inc CY7C245A-18WMB vs 5962-8873503LX
QP7C292A-35WMB UVPROM, 2KX8, CMOS, CDIP24, 0.600 INCH, CERAMIC, GDIP1-24 Teledyne e2v CY7C245A-18WMB vs QP7C292A-35WMB
CY7C245-45PC OTP ROM, 2KX8, 70ns, CMOS, PDIP24, 0.300 INCH, SLIM, PLASTIC, DIP-24 Cypress Semiconductor CY7C245A-18WMB vs CY7C245-45PC
5962-8981503LB UVPROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8981503LB
QP7C291A-35WC UVPROM, 2KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP3-24 QP Semiconductor CY7C245A-18WMB vs QP7C291A-35WC
5962-8873503LX OTP ROM, 2KX8, 25ns, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8873503LX
5962-8873504LB OTP ROM, 2KX8, 12ns, CMOS, CDIP24, CERAMIC, DIP-24 Cypress Semiconductor CY7C245A-18WMB vs 5962-8873504LB

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