There are no models available for this part yet.
Overview of CYDD04S72V18-167BGC by Cypress Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for CYDD04S72V18-167BGC by Cypress Semiconductor
Part Data Attributes for CYDD04S72V18-167BGC by Cypress Semiconductor
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|
|
|---|---|
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Pbfree Code
|
No
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Rohs Code
|
No
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Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
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CYPRESS SEMICONDUCTOR CORP
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Part Package Code
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BGA
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Package Description
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23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, PLASTIC, BGA-484
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Pin Count
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484
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Reach Compliance Code
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compliant
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ECCN Code
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3A991.B.2.A
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HTS Code
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8542.32.00.41
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Access Time-Max
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9 ns
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Additional Feature
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PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATE AT 1.8V
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Clock Frequency-Max (fCLK)
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167 MHz
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I/O Type
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COMMON
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JESD-30 Code
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S-PBGA-B484
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JESD-609 Code
|
e0
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Length
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23 mm
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Memory Density
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4718592 bit
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Memory IC Type
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MULTI-PORT SRAM
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Memory Width
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72
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Moisture Sensitivity Level
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3
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Number of Functions
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1
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Number of Ports
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2
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Number of Terminals
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484
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Number of Words
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65536 words
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Number of Words Code
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64000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
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70 °C
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Operating Temperature-Min
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Organization
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64KX72
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Output Characteristics
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3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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BGA
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Package Equivalence Code
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BGA484,22X22,40
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY
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Parallel/Serial
|
PARALLEL
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Peak Reflow Temperature (Cel)
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NOT SPECIFIED
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Qualification Status
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Not Qualified
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Seated Height-Max
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2.16 mm
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Standby Current-Max
|
0.15 A
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Standby Voltage-Min
|
1.5 V
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Supply Current-Max
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0.74 mA
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Supply Voltage-Max (Vsup)
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1.58 V
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Supply Voltage-Min (Vsup)
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1.42 V
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Supply Voltage-Nom (Vsup)
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1.5 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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COMMERCIAL
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Terminal Finish
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Tin/Lead (Sn/Pb)
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Terminal Form
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BALL
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Terminal Pitch
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1 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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23 mm
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Alternate Parts for CYDD04S72V18-167BGC
This table gives cross-reference parts and alternative options found for CYDD04S72V18-167BGC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CYDD04S72V18-167BGC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CYDD04S72V18-167BGXC | Dual-Port SRAM, 64KX72, 9ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 | Cypress Semiconductor | CYDD04S72V18-167BGC vs CYDD04S72V18-167BGXC |
| CYDD04S72V18-167BGXI | Dual-Port SRAM, 64KX72, 9ns, CMOS, PBGA484, 23 X 23 MM, 2.03 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-484 | Cypress Semiconductor | CYDD04S72V18-167BGC vs CYDD04S72V18-167BGXI |