Datasheets
DPS512S8AP-35I by:

SRAM Module, 512KX8, 35ns, CMOS, CDMA32, CERDIP-32

Part Details for DPS512S8AP-35I by Twilight Technology Inc

Overview of DPS512S8AP-35I by Twilight Technology Inc

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for DPS512S8AP-35I

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DPS512S8AP-35I Part Data Attributes

DPS512S8AP-35I Twilight Technology Inc
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DPS512S8AP-35I Twilight Technology Inc SRAM Module, 512KX8, 35ns, CMOS, CDMA32, CERDIP-32
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer TWILIGHT TECHNOLOGY INC
Part Package Code MODULE
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 35 ns
I/O Type COMMON
JESD-30 Code R-CDMA-T32
Memory Density 4194304 bit
Memory IC Type SRAM MODULE
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Standby Current-Max 0.0016 A
Standby Voltage-Min 2 V
Supply Current-Max 0.245 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for DPS512S8AP-35I

This table gives cross-reference parts and alternative options found for DPS512S8AP-35I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DPS512S8AP-35I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
WMS512K8-35CIA Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-35I vs WMS512K8-35CIA
5962-9207807HTC SRAM Module, 512KX8, 35ns, CMOS, DIP-32 White Microelectronics DPS512S8AP-35I vs 5962-9207807HTC
5962-9561307HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-35I vs 5962-9561307HYC
WS512K8-35CM SRAM Module, 512KX8, 35ns, CMOS, CDMA32, 0.600 INCH, CERAMIC, DIP-32 Mercury Systems Inc DPS512S8AP-35I vs WS512K8-35CM
5962-9207807HTA SRAM Module, 512KX8, 35ns, CMOS, DIP-32 Mercury Systems Inc DPS512S8AP-35I vs 5962-9207807HTA
CYM1466HD-35MB SRAM Module, 512KX8, 35ns, CMOS Cypress Semiconductor DPS512S8AP-35I vs CYM1466HD-35MB
5962-9561307HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32 Cobham Advanced Electronic Solutions DPS512S8AP-35I vs 5962-9561307HYC
5962-9561312HYC Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, White Electronic Designs Corp DPS512S8AP-35I vs 5962-9561312HYC
AS5C4008CW-35E/IT Standard SRAM, 512KX8, 35ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Micross Components DPS512S8AP-35I vs AS5C4008CW-35E/IT
5962-9207807HXC SRAM Module, 512KX8, 35ns, CMOS, DIP-32 White Microelectronics DPS512S8AP-35I vs 5962-9207807HXC
Part Number Description Manufacturer Compare
5962-9318712HTA Cache SRAM Module, 128KX32, 55ns, CMOS, HIP-66 Cobham Power Products DPS512S8AP-35I vs 5962-9318712HTA
5962-8685910LA CDIP-24, Tube Integrated Device Technology Inc DPS512S8AP-35I vs 5962-8685910LA
5962-9318705H5X SRAM Module, 128KX32, 55ns, CMOS, CPGA66, 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66 Mercury Systems Inc DPS512S8AP-35I vs 5962-9318705H5X
5962-8854504YA Standard SRAM, 64KX4, 70ns, CMOS, CDFP28, CERAMIC, FLATPACK-28 Micross Components DPS512S8AP-35I vs 5962-8854504YA
P4C164-45LSI Standard SRAM, 8KX8, 45ns, CMOS, CQCC28, 0.350 X 0.550 INCH, ROHS COMPLIANT, CERAMIC, LCC-28 Pyramid Semiconductor Corporation DPS512S8AP-35I vs P4C164-45LSI
MT5C2568CW-25L/XT Standard SRAM, 32KX8, 25ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components DPS512S8AP-35I vs MT5C2568CW-25L/XT
5962-9561307HYC Cache SRAM, 512KX8, 35ns, CMOS, CDIP32, 1.600 X 0.600 INCH, 0.200 INCH HEIGHT, HERMETIC SEALED, CERAMIC, DIP-32 Cobham Power Products DPS512S8AP-35I vs 5962-9561307HYC
5962-9461108HYC Cache SRAM Module, 512KX32, 25ns, CMOS, CQFP68, 1.560 X 1.560 INCH, 0.140 INCH HEIGHT, LOW PROFILE, CERAMIC, QFP-68 Cobham Power Products DPS512S8AP-35I vs 5962-9461108HYC
MT5C2568CW-70L/XT Standard SRAM, 32KX8, 70ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components DPS512S8AP-35I vs MT5C2568CW-70L/XT
5962-9461110HMC Cache SRAM Module, 512KX32, 17ns, CMOS, CQFP68, CO-FIRED CERAMIC, QFP-68 Mercury Systems Inc DPS512S8AP-35I vs 5962-9461110HMC

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