Part Details for DSP56321VL200 by NXP Semiconductors
Overview of DSP56321VL200 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (4 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for DSP56321VL200
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
73J0047
|
Newark | Ic, dsp,24-Bit, cmos, bga,196Pin, plastic Rohs Compliant: Yes |Nxp DSP56321VL200 Min Qty: 126 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$96.7700 | Buy Now |
DISTI #
DSP56321VL200
|
Avnet Americas | DSP Fixed-Point 24-Bit 200MHz 200MIPS 196-Pin MA-BGA Tray - Trays (Alt: DSP56321VL200) RoHS: Compliant Min Qty: 126 Package Multiple: 126 Container: Tray | 0 |
|
$93.7395 / $108.1029 | Buy Now |
|
Flip Electronics | Stock, ship today | 201 |
|
$185.6400 | RFQ |
Part Details for DSP56321VL200
DSP56321VL200 CAD Models
DSP56321VL200 Part Data Attributes:
|
DSP56321VL200
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
DSP56321VL200
NXP Semiconductors
24-BIT, 200MHz, OTHER DSP, PBGA196
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Additional Feature | ALSO REQUIRES 3.3V SUPPLY | |
Address Bus Width | 18 | |
Barrel Shifter | YES | |
Boundary Scan | YES | |
Clock Frequency-Max | 200 MHz | |
External Data Bus Width | 24 | |
Format | FIXED POINT | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PBGA-B196 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 196 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Supply Voltage-Max | 1.7 V | |
Supply Voltage-Min | 1.5 V | |
Supply Voltage-Nom | 1.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, OTHER |
Alternate Parts for DSP56321VL200
This table gives cross-reference parts and alternative options found for DSP56321VL200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of DSP56321VL200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
DSP56321VL200R2 | 24-BIT, 200MHz, OTHER DSP, PBGA196, MOLDED ARRAY PROCESS, BGA-196 | Freescale Semiconductor | DSP56321VL200 vs DSP56321VL200R2 |
DSP56321VL200 | 24-BIT, 200MHz, OTHER DSP, PBGA196, LEAD FREE, MOLDED ARRAY PROCESS, BGA-196 | Freescale Semiconductor | DSP56321VL200 vs DSP56321VL200 |
DSP56321VF200 | 24-BIT, 200MHz, OTHER DSP, PBGA196 | NXP Semiconductors | DSP56321VL200 vs DSP56321VF200 |
DSP56321VF200R2 | 24-BIT, 200MHz, OTHER DSP, PBGA196, MOLDED ARRAY PROCESS, BGA-196 | Freescale Semiconductor | DSP56321VL200 vs DSP56321VF200R2 |