Part Details for DSPIC30F5015ATP-I/PT by Microchip Technology Inc
Overview of DSPIC30F5015ATP-I/PT by Microchip Technology Inc
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for DSPIC30F5015ATP-I/PT
DSPIC30F5015ATP-I/PT CAD Models
DSPIC30F5015ATP-I/PT Part Data Attributes:
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DSPIC30F5015ATP-I/PT
Microchip Technology Inc
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DSPIC30F5015ATP-I/PT
Microchip Technology Inc
Digital Signal Processor
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Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | TQFP-64 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | ||
Barrel Shifter | YES | |
Bit Size | 16 | |
Boundary Scan | NO | |
Clock Frequency-Max | 40 MHz | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
Internal Bus Architecture | MULTIPLE | |
JESD-30 Code | S-PQFP-G64 | |
Length | 10 mm | |
Low Power Mode | YES | |
Number of External Interrupts | 5 | |
Number of Terminals | 64 | |
Number of Timers | 7 | |
On Chip Data RAM Width | 8 | |
On Chip Program ROM Width | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFQFP | |
Package Equivalence Code | TQFP64,.47SQ | |
Package Shape | SQUARE | |
Package Style | FLATPACK, THIN PROFILE, FINE PITCH | |
RAM (words) | 2048 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.2 mm | |
Supply Current-Max | 300 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | DIGITAL SIGNAL PROCESSOR, CONTROLLER |