Part Details for EDI88130CS20L32M by Microsemi Corporation
Overview of EDI88130CS20L32M by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for EDI88130CS20L32M
EDI88130CS20L32M CAD Models
EDI88130CS20L32M Part Data Attributes
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EDI88130CS20L32M
Microsemi Corporation
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Datasheet
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EDI88130CS20L32M
Microsemi Corporation
Standard SRAM, 128KX8, 20ns, CMOS, CQCC32, LCC-32
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | QFJ | |
| Package Description | LCC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 20 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CQCC-N32 | |
| Length | 13.97 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC32,.45X.55 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.048 mm | |
| Standby Current-Max | 0.01 A | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.225 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.43 mm |
Alternate Parts for EDI88130CS20L32M
This table gives cross-reference parts and alternative options found for EDI88130CS20L32M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EDI88130CS20L32M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CXK584000P-20LL | Standard SRAM, 512KX8, 200ns, CMOS, PDIP32 | Sony Semiconductor | EDI88130CS20L32M vs CXK584000P-20LL |
| CXK584000M-20LL | Standard SRAM, 512KX8, 200ns, CMOS, PDSO32 | Sony Semiconductor | EDI88130CS20L32M vs CXK584000M-20LL |
| CXK584000YM-20LL | Standard SRAM, 512KX8, 200ns, CMOS, PDSO32 | Sony Semiconductor | EDI88130CS20L32M vs CXK584000YM-20LL |
| GVT72512A8J-20LI | Standard SRAM, 512KX8, 20ns, CMOS, PDSO36 | Cypress Semiconductor | EDI88130CS20L32M vs GVT72512A8J-20LI |
| D2186A | Standard SRAM, 8KX8, NMOS, CDIP28, HERMETIC SEALED, DIP-28 | Intel Corporation | EDI88130CS20L32M vs D2186A |