Datasheets
F356635S by: Fairchild Semiconductor Corporation

MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24

Part Details for F356635S by Fairchild Semiconductor Corporation

Overview of F356635S by Fairchild Semiconductor Corporation

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Applications Space Technology Aerospace and Defense

Part Details for F356635S

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F356635S Part Data Attributes

F356635S Fairchild Semiconductor Corporation
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F356635S Fairchild Semiconductor Corporation MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24
Part Life Cycle Code Obsolete
Ihs Manufacturer FAIRCHILD SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP,
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
JESD-30 Code R-GDIP-T24
Length 32.0675 mm
Memory Density 4194304 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 6.37 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for F356635S

This table gives cross-reference parts and alternative options found for F356635S. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of F356635S, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
F356435S MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation F356635S vs F356435S
F356535P MASK ROM, 8KX8, 350ns, NMOS, PDIP24, PLASTIC, DIP-24 Fairchild Semiconductor Corporation F356635S vs F356535P
Part Number Description Manufacturer Compare
5962-8751512LX UVPROM, 8KX8, 25ns, CMOS, CDIP24, CERAMIC, DIP-24 QP Semiconductor F356635S vs 5962-8751512LX
AT27HC641R-35LC UVPROM, 8KX8, 35ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 Atmel Corporation F356635S vs AT27HC641R-35LC
X86C64DM EEPROM, 8KX8, 120ns, Parallel, CMOS, CDIP24, HERMETIC SEALED, CERDIP-24 Xicor Inc F356635S vs X86C64DM
PY26345WM UVPROM, 8KX8, CMOS, CDIP24, 0.300 INCH, CERAMIC, DIP-24 Pyramid Semiconductor Corporation F356635S vs PY26345WM
WS57C49C-25D 8KX8 UVPROM, 25ns, CDIP24, 0.600 INCH, CERDIP-24 STMicroelectronics F356635S vs WS57C49C-25D
X86C64P EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP24, PLASTIC, DIP-24 Xicor Inc F356635S vs X86C64P
CY7C264-35WMB UVPROM, 8KX8, 35ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Cypress Semiconductor F356635S vs CY7C264-35WMB
27HC641L-70I/J 8K X 8 UVPROM, 70 ns, CDIP24, WINDOWED, CERDIP-24 Microchip Technology Inc F356635S vs 27HC641L-70I/J
AT27HC641R-90DM/883 UVPROM, 8KX8, 90ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Atmel Corporation F356635S vs AT27HC641R-90DM/883
AT27HC641R-45LM UVPROM, 8KX8, 45ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 Atmel Corporation F356635S vs AT27HC641R-45LM

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