Memory
GS8662D38BGD-400I
GSI Technology
Description: QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Overview of GS8662D38BGD-400I by GSI Technology

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Available Datasheets

Part # Manufacturer Description Datasheet
LTC2400IS8#PBF Analog Devices 24-B µPwr No Lat Delta-Sigma A
LTC6400IUD-8#PBF Analog Devices 2.2GHz L N, L Dist Diff ADC Dr
LTC2400IS8#TRPBF Analog Devices 24-B µPwr No Lat Delta-Sigma A

Price & Stock for GS8662D38BGD-400I by GSI Technology

Part # Manufacturer Description Stock Price Buy
DISTI # GS8662D38BGD-400I
Avnet Americas SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Bulk - Trays (Alt: GS8662D38BGD-400I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray 0
  • 144 $102.0690
  • 288 $100.2132
  • 576 $95.2644
  • 864 $92.7900
  • 1,152 $89.6970
  • 1,440 $85.3668
  • 14,400 $82.8924
$82.8924 / $102.0690 Buy Now
DISTI # 464-GS8662D38BGD400I
Mouser Electronics SRAM 1.8 or 1.5V 2M x 36 72M RoHS: Compliant 0
  • 15 $96.9600
  • 30 $94.8300
  • 60 $92.8400
$92.8400 / $96.9600 Order Now
DISTI # GS8662D38BGD-400I
Avnet Silica SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Bulk (Alt: GS8662D38BGD-400I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 27 Weeks, 0 Days Silica - 0
Buy Now

CAD Models for GS8662D38BGD-400I by GSI Technology
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Part Data Attributes for GS8662D38BGD-400I by GSI Technology

GS8662D38BGD-400I
GSI Technology
-
-
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Active
Ihs Manufacturer
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
LBGA,
Pin Count
165
Reach Compliance Code
compliant
ECCN Code
3A991.B.2.B
HTS Code
8542.32.00.41
Factory Lead Time
24 Weeks
Access Time-Max
0.45 ns
Additional Feature
PIPELINED ARCHITECTURE
JESD-30 Code
R-PBGA-B165
JESD-609 Code
e1
Length
15 mm
Memory Density
75497472 bit
Memory IC Type
QDR SRAM
Memory Width
36
Moisture Sensitivity Level
3
Number of Functions
1
Number of Terminals
165
Number of Words
2097152 words
Number of Words Code
2000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX36
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.4 mm
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
Want to compare parts?
  1. GS8662D38BGD-400I
    GSI Technology
    QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
    VS

Alternate Parts for GS8662D38BGD-400I

This table gives cross-reference parts and alternative options found for GS8662D38BGD-400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662D38BGD-400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
IS61QDP2B42M36A1-300M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc GS8662D38BGD-400I vs IS61QDP2B42M36A1-300M3L
GS8662D36BGD-400IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D38BGD-400I vs GS8662D36BGD-400IT
GS8662D36BD-350I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D38BGD-400I vs GS8662D36BD-350I
GS8662D36BGD-350 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D38BGD-400I vs GS8662D36BGD-350
GS8662Q36BD-357I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662D38BGD-400I vs GS8662Q36BD-357I
GS8662D36BGD-350IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D38BGD-400I vs GS8662D36BGD-350IT
CY7C2565KV18-450BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D38BGD-400I vs CY7C2565KV18-450BZI
CY7C2565KV18-400BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor GS8662D38BGD-400I vs CY7C2565KV18-400BZI
GS8662D36BGD-350I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662D38BGD-400I vs GS8662D36BGD-350I
CY7C1545KV18-400BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG GS8662D38BGD-400I vs CY7C1545KV18-400BZXI

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