Part Details for GS8662Q09BGD-167T by GSI Technology
Overview of GS8662Q09BGD-167T by GSI Technology
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
86551167TLF | Amphenol Communications Solutions | D-Sub Accessories, Input Output Connectors, Female screw lock. |
Part Details for GS8662Q09BGD-167T
GS8662Q09BGD-167T CAD Models
GS8662Q09BGD-167T Part Data Attributes
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GS8662Q09BGD-167T
GSI Technology
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Datasheet
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GS8662Q09BGD-167T
GSI Technology
Standard SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 0.5 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 9 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX9 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS8662Q09BGD-167T
This table gives cross-reference parts and alternative options found for GS8662Q09BGD-167T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q09BGD-167T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS8662D10BGD-300 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662D10BGD-300 |
GS8662T09BGD-400IT | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662T09BGD-400IT |
GS8662R09BD-200 | Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662R09BD-200 |
CY7C1526KV18-333BZXC | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Infineon Technologies AG | GS8662Q09BGD-167T vs CY7C1526KV18-333BZXC |
CY7C1529V18-278BZXC | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662Q09BGD-167T vs CY7C1529V18-278BZXC |
GS8662D09GE-200T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662D09GE-200T |
GS8662T10BGD-333T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662T10BGD-333T |
GS8662TT10BD-300T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662TT10BD-300T |
CY7C1529V18-200BZXI | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662Q09BGD-167T vs CY7C1529V18-200BZXI |
GS8662S09E-167 | DDR SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 | GSI Technology | GS8662Q09BGD-167T vs GS8662S09E-167 |