Part Details for GS8662Q36BGD-250 by GSI Technology
Overview of GS8662Q36BGD-250 by GSI Technology
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for GS8662Q36BGD-250
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
GS8662Q36BGD-250
|
Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray - Trays (Alt: GS8662Q36BGD-250) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Tray | 0 |
|
$66.9732 / $82.4670 | Buy Now |
DISTI #
464-GS8662Q36BGD-250
|
Mouser Electronics | SRAM 1.8 or 1.5V 2M x 36 72M RoHS: Compliant | 0 |
|
$65.6600 / $78.3400 | Order Now |
DISTI #
GS8662Q36BGD-250
|
Avnet Silica | SRAM Chip Sync Dual 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA Tray (Alt: GS8662Q36BGD-250) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 27 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
Part Details for GS8662Q36BGD-250
GS8662Q36BGD-250 CAD Models
GS8662Q36BGD-250 Part Data Attributes
|
GS8662Q36BGD-250
GSI Technology
Buy Now
Datasheet
|
Compare Parts:
GS8662Q36BGD-250
GSI Technology
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | LBGA, BGA165,11X15,40 | |
Pin Count | 165 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.B | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 24 Weeks | |
Access Time-Max | 0.45 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 250 MHz | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PBGA-B165 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Memory Density | 75497472 bit | |
Memory IC Type | QDR SRAM | |
Memory Width | 36 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 165 | |
Number of Words | 2097152 words | |
Number of Words Code | 2000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 2MX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LBGA | |
Package Equivalence Code | BGA165,11X15,40 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.4 mm | |
Standby Voltage-Min | 1.7 V | |
Supply Current-Max | 0.895 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 13 mm |
Alternate Parts for GS8662Q36BGD-250
This table gives cross-reference parts and alternative options found for GS8662Q36BGD-250. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662Q36BGD-250, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
K7R643682M-FC25 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | GS8662Q36BGD-250 vs K7R643682M-FC25 |
GS8662Q36BD-250 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662Q36BGD-250 vs GS8662Q36BD-250 |
CY7C1514JV18-250BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662Q36BGD-250 vs CY7C1514JV18-250BZC |
IS61QDB22M36-250M3 | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LFBGA-165 | Integrated Silicon Solution Inc | GS8662Q36BGD-250 vs IS61QDB22M36-250M3 |
K7R643682M-EC250 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-165 | Samsung Semiconductor | GS8662Q36BGD-250 vs K7R643682M-EC250 |
CY7C1514KV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | GS8662Q36BGD-250 vs CY7C1514KV18-250BZXC |
CY7C1514AV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662Q36BGD-250 vs CY7C1514AV18-250BZXC |
K7R643682M-EC25 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | GS8662Q36BGD-250 vs K7R643682M-EC25 |
IS61QDB22M36-250M3L | DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | GS8662Q36BGD-250 vs IS61QDB22M36-250M3L |
K7R643682M-FC25T | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165 | Samsung Semiconductor | GS8662Q36BGD-250 vs K7R643682M-FC25T |