Part Details for GS8662S09BGD-350 by GSI Technology
Overview of GS8662S09BGD-350 by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Price & Stock for GS8662S09BGD-350
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662S09BGD-350
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662S09BGD-350) RoHS: Compliant Min Qty: 15 Package Multiple: 15 Lead time: 8 Weeks, 0 Days Container: Bulk | 0 |
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RFQ | |
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DISTI #
464-GS8662S09BGD-350
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 9 72M RoHS: Compliant | 0 |
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$87.2700 / $91.1500 | Order Now |
Part Details for GS8662S09BGD-350
GS8662S09BGD-350 CAD Models
GS8662S09BGD-350 Part Data Attributes
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GS8662S09BGD-350
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662S09BGD-350
GSI Technology
Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 8 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 9 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX9 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |
Alternate Parts for GS8662S09BGD-350
This table gives cross-reference parts and alternative options found for GS8662S09BGD-350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662S09BGD-350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| GS8662D09BD-300T | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662D09BD-300T |
| GS8662Q10BD-300T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662Q10BD-300T |
| CY7C1527JV18-300BZI | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S09BGD-350 vs CY7C1527JV18-300BZI |
| GS8662Q10BGD-333IT | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662Q10BGD-333IT |
| GS8662R09GE-250I | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 MM X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662R09GE-250I |
| GS8662T11BGD-450 | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662T11BGD-450 |
| GS81302S09GE-200T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS81302S09GE-200T |
| GS8662S09E-250T | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, MO-216CAB-1, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662S09E-250T |
| GS8662S09GE-300I | DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 | GSI Technology | GS8662S09BGD-350 vs GS8662S09GE-300I |
| CY7C1526V18-300BZC | QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662S09BGD-350 vs CY7C1526V18-300BZC |