H1264B-55D
Hughes Aircraft
Description: MASK ROM, 8KX8, 55ns, CMOS, CDIP24

Overview of H1264B-55D by Hughes Aircraft

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Part Data Attributes for H1264B-55D by Hughes Aircraft

H1264B-55D
Hughes Aircraft
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
HUGHES AIRCRAFT
Package Description
,
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
250 ns
Additional Feature
STATIC CMOS
JESD-30 Code
R-CDIP-T24
Memory Density
1048576 bit
Memory IC Type
MASK ROM
Memory Width
8
Number of Functions
1
Number of Terminals
24
Number of Words
8192 words
Number of Words Code
8000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Organization
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Supply Current-Max
0.08 mA
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
MILITARY
Terminal Form
THROUGH-HOLE
Terminal Position
DUAL
Want to compare parts?
  1. H1264B-55D
    Hughes Aircraft
    MASK ROM, 8KX8, 55ns, CMOS, CDIP24
    VS

Alternate Parts for H1264B-55D

This table gives cross-reference parts and alternative options found for H1264B-55D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of H1264B-55D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
H1264B-55Y[PWRDOWN] MASK ROM, 8KX8, 55ns, CMOS, CDIP24 Hughes Aircraft H1264B-55D vs H1264B-55Y[PWRDOWN]
Part Number Description Manufacturer Compare
AT27HC642R-70DM UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.300 INCH, WINDOWED, CERDIP-24 Atmel Corporation H1264B-55D vs AT27HC642R-70DM
5962-8751503JA 8KX8 UVPROM, 70ns, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 STMicroelectronics H1264B-55D vs 5962-8751503JA
27HC641L-55/J 8K X 8 UVPROM, 55 ns, CDIP24, WINDOWED, CERDIP-24 Microchip Technology Inc H1264B-55D vs 27HC641L-55/J
WS57C49B-55T UVPROM, 8KX8, 55ns, CMOS, CDIP24, Waferscale Integration Inc H1264B-55D vs WS57C49B-55T
M27HC641-35XFS1 8KX8 UVPROM, 35ns, CDIP24, 0.300 INCH, FRIT SEALED, WINDOWED, CERAMIC, DIP-24 STMicroelectronics H1264B-55D vs M27HC641-35XFS1
27HC641-70/J 8K X 8 UVPROM, 70 ns, CDIP24, WINDOWED, CERDIP-24 Microchip Technology Inc H1264B-55D vs 27HC641-70/J
AT27HC641R-70DM UVPROM, 8KX8, 70ns, CMOS, CDIP24, 0.600 INCH, WINDOWED, CERDIP-24 Atmel Corporation H1264B-55D vs AT27HC641R-70DM
F356435S MASK ROM, 8KX8, 350ns, NMOS, CDIP24, CERAMIC, DIP-24 Fairchild Semiconductor Corporation H1264B-55D vs F356435S
HI1264B-D-000 MASK ROM, 8KX8, 35ns, CMOS, CDIP24 Hughes Aircraft H1264B-55D vs HI1264B-D-000
AT27HC641R-45LC UVPROM, 8KX8, 45ns, CMOS, CQCC28, WINDOWED, CERAMIC, LCC-28 Atmel Corporation H1264B-55D vs AT27HC641R-45LC

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