Part Details for H8F2SBRQCMJR-4HM by SK Hynix Inc
Overview of H8F2SBRQCMJR-4HM by SK Hynix Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for H8F2SBRQCMJR-4HM
H8F2SBRQCMJR-4HM CAD Models
H8F2SBRQCMJR-4HM Part Data Attributes
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H8F2SBRQCMJR-4HM
SK Hynix Inc
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Datasheet
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H8F2SBRQCMJR-4HM
SK Hynix Inc
Memory Circuit, 8GX1, CMOS, PBGA199, FBGA-199
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Part Life Cycle Code | Active | |
Ihs Manufacturer | SK HYNIX INC | |
Package Description | FBGA-199 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | SEATED HT-CALCULATED AND NAND FLASH IS ORGANISED AS 256MX8 AND SDRAM IS ORGANISED AS 64MX32 | |
JESD-30 Code | R-PBGA-B199 | |
Length | 18 mm | |
Memory Density | 8589934592 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 1 | |
Number of Functions | 1 | |
Number of Terminals | 199 | |
Number of Words | 8589934592 words | |
Number of Words Code | 8000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Organization | 8GX1 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Width | 12 mm |