Part Details for H8F6SDRQCMJR-4HM by SK Hynix Inc
Overview of H8F6SDRQCMJR-4HM by SK Hynix Inc
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Part Details for H8F6SDRQCMJR-4HM
H8F6SDRQCMJR-4HM CAD Models
H8F6SDRQCMJR-4HM Part Data Attributes
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H8F6SDRQCMJR-4HM
SK Hynix Inc
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Datasheet
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H8F6SDRQCMJR-4HM
SK Hynix Inc
Memory Circuit, 16GX2, CMOS, PBGA199, FBGA-199
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Part Life Cycle Code | Active | |
Ihs Manufacturer | SK HYNIX INC | |
Package Description | FBGA-199 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | SEATED HT-CALCULATED AND NAND FLASH IS ORGANISED AS 256MX8 AND SDRAM IS ORGANISED AS 64MX32 | |
JESD-30 Code | R-PBGA-B199 | |
Length | 18 mm | |
Memory Density | 34359738368 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 2 | |
Number of Functions | 1 | |
Number of Terminals | 199 | |
Number of Words | 17179869184 words | |
Number of Words Code | 16000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
Organization | 16GX2 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Seated Height-Max | 1.4 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Width | 12 mm |