Part Details for H8FASDRJCMJR-4HM by SK Hynix Inc
Overview of H8FASDRJCMJR-4HM by SK Hynix Inc
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for H8FASDRJCMJR-4HM
H8FASDRJCMJR-4HM CAD Models
H8FASDRJCMJR-4HM Part Data Attributes
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H8FASDRJCMJR-4HM
SK Hynix Inc
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Datasheet
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H8FASDRJCMJR-4HM
SK Hynix Inc
Memory Circuit, 8GX4, CMOS, PBGA199, FBGA-199
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | SK HYNIX INC | |
| Package Description | FBGA-199 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Additional Feature | SEATED HT-CALCULATED AND NAND FLASH IS ORGANISED AS 256MX8 AND SDRAM IS ORGANISED AS 32MX32 | |
| JESD-30 Code | R-PBGA-B199 | |
| Length | 18 mm | |
| Memory Density | 34359738368 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 4 | |
| Number of Functions | 1 | |
| Number of Terminals | 199 | |
| Number of Words | 8589934592 words | |
| Number of Words Code | 8000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -30 °C | |
| Organization | 8GX4 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm |