Part Details for HD637B01X0C by Hitachi Ltd
Overview of HD637B01X0C by Hitachi Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (7 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Consumer Electronics
Education and Research
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for HD637B01X0C
HD637B01X0C CAD Models
HD637B01X0C Part Data Attributes:
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HD637B01X0C
Hitachi Ltd
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Datasheet
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HD637B01X0C
Hitachi Ltd
Microcontroller, 8-Bit, UVPROM, 6800 CPU, 2MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | HITACHI LTD | |
Part Package Code | DIP | |
Package Description | SHRINK, CERAMIC, DIP-64 | |
Pin Count | 64 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Address Bus Width | 16 | |
Bit Size | 8 | |
CPU Family | 6800 | |
Clock Frequency-Max | 8 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 8 | |
JESD-30 Code | R-CDIP-T64 | |
JESD-609 Code | e0 | |
Length | 57.3 mm | |
Number of I/O Lines | 53 | |
Number of Terminals | 64 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
PWM Channels | NO | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | WSDIP | |
Package Equivalence Code | SDIP64,.75 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW, SHRINK PITCH | |
Qualification Status | Not Qualified | |
RAM (bytes) | 192 | |
ROM (words) | 4096 | |
ROM Programmability | UVPROM | |
Seated Height-Max | 5.6 mm | |
Speed | 2 MHz | |
Supply Current-Max | 20 mA | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 1.778 mm | |
Terminal Position | DUAL | |
Width | 19.05 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |
Alternate Parts for HD637B01X0C
This table gives cross-reference parts and alternative options found for HD637B01X0C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HD637B01X0C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HD63B01X0F | Microcontroller, 8-Bit, MROM, 6800 CPU, 2MHz, CMOS, PQFP80, PLASTIC, QFP-80 | Hitachi Ltd | HD637B01X0C vs HD63B01X0F |
HD63B01X0CP | Microcontroller, 8-Bit, MROM, 6800 CPU, 2MHz, CMOS, PQCC68, PLASTIC, LCC-68 | Hitachi Ltd | HD637B01X0C vs HD63B01X0CP |
HD63B01Y0F | Microcontroller, 8-Bit, MROM, 6800 CPU, 2MHz, CMOS, PQFP64, PLASTIC, QFP-64 | Hitachi Ltd | HD637B01X0C vs HD63B01Y0F |
HD637B01Y0C | Microcontroller, 8-Bit, UVPROM, 6800 CPU, 2MHz, CMOS, CDIP64, SHRINK, CERAMIC, DIP-64 | Hitachi Ltd | HD637B01X0C vs HD637B01Y0C |
HD63B01Y0CP | Microcontroller, 8-Bit, MROM, 6800 CPU, 2MHz, CMOS, PQCC68, PLASTIC, LCC-68 | Hitachi Ltd | HD637B01X0C vs HD63B01Y0CP |
HD63B01X0P | Microcontroller, 8-Bit, MROM, 6800 CPU, 2MHz, CMOS, PDIP64, SHRINK, PLASTIC, DIP-64 | Hitachi Ltd | HD637B01X0C vs HD63B01X0P |
HD63B01Y0H | Microcontroller, 8-Bit, MROM, 6800 CPU, 2MHz, CMOS, PQFP64, PLASTIC, QFP-64 | Hitachi Ltd | HD637B01X0C vs HD63B01Y0H |