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Overview of HM6AEB18202BPL50 by Renesas Electronics Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for HM6AEB18202BPL50 by Renesas Electronics Corporation
Part Data Attributes for HM6AEB18202BPL50 by Renesas Electronics Corporation
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Contact Manufacturer
|
Ihs Manufacturer
|
RENESAS ELECTRONICS CORP
|
Part Package Code
|
BGA
|
Package Description
|
15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
0.45 ns
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e0
|
Length
|
17 mm
|
Memory Density
|
37748736 bit
|
Memory IC Type
|
DDR SRAM
|
Memory Width
|
18
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
2097152 words
|
Number of Words Code
|
2000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
2MX18
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.46 mm
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
15 mm
|
Alternate Parts for HM6AEB18202BPL50
This table gives cross-reference parts and alternative options found for HM6AEB18202BPL50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HM6AEB18202BPL50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
MCM69F817ZP6 | 256KX18 CACHE SRAM, 6ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 | Motorola Mobility LLC | HM6AEB18202BPL50 vs MCM69F817ZP6 |
IBM043640QLAA-6 | Standard SRAM, 128KX36, 7.5ns, CMOS, PBGA119, BGA-119 | IBM | HM6AEB18202BPL50 vs IBM043640QLAA-6 |
IS61DDP2B21M36A-400B4L | DDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 | Integrated Silicon Solution Inc | HM6AEB18202BPL50 vs IS61DDP2B21M36A-400B4L |
K7N401801A-TC160 | ZBT SRAM, 256KX18, 3.5ns, CMOS, PQFP100, 20 X 14 MM, TQFP-100 | Samsung Semiconductor | HM6AEB18202BPL50 vs K7N401801A-TC160 |
K7P163612M-HC48 | Standard SRAM, 512KX36, 4.8ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FLIP CHIP, BGA-119 | Samsung Semiconductor | HM6AEB18202BPL50 vs K7P163612M-HC48 |
KM732V789H-67 | Cache SRAM, 128KX32, 3.8ns, CMOS, PBGA119, BGA-119 | Samsung Semiconductor | HM6AEB18202BPL50 vs KM732V789H-67 |
IS61VPS10018-166TQ | Cache SRAM, 1MX18, 3.5ns, CMOS, PQFP100, TQFP-100 | Integrated Silicon Solution Inc | HM6AEB18202BPL50 vs IS61VPS10018-166TQ |
IS61QDPB21M36A-333B4I | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 | Integrated Silicon Solution Inc | HM6AEB18202BPL50 vs IS61QDPB21M36A-333B4I |
MCM69F817ZP6.5R | 256KX18 CACHE SRAM, 6.5ns, PBGA119, 7 X 17 MM, PLASTIC, BGA-119 | Motorola Mobility LLC | HM6AEB18202BPL50 vs MCM69F817ZP6.5R |
K7I163684B-FC330 | DDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | HM6AEB18202BPL50 vs K7I163684B-FC330 |