Part Details for HMC830LP6GE by Hittite Microwave Corp
Overview of HMC830LP6GE by Hittite Microwave Corp
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Applications
Aerospace and Defense
Part Details for HMC830LP6GE
HMC830LP6GE CAD Models
HMC830LP6GE Part Data Attributes
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HMC830LP6GE
Hittite Microwave Corp
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Datasheet
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HMC830LP6GE
Hittite Microwave Corp
RF and Baseband Circuit, PQCC40, 6 X 6 MM, ROHS COMPLIANT, PLASTIC, SMT-40
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | HITTITE MICROWAVE CORP | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, | |
| Pin Count | 40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A991.B | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | S-PQCC-N40 | |
| JESD-609 Code | e3 | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 40 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.9 mm | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | RF AND BASEBAND CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 6 mm |