Datasheets
HN27C512G-20 by:

UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28

Part Details for HN27C512G-20 by Hitachi Ltd

Overview of HN27C512G-20 by Hitachi Ltd

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Applications Computing and Data Storage Financial Technology (Fintech) Healthcare Telecommunications

Part Details for HN27C512G-20

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HN27C512G-20 Part Data Attributes

HN27C512G-20 Hitachi Ltd
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HN27C512G-20 Hitachi Ltd UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERAMIC, DIP-28
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer HITACHI LTD
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 200 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
JESD-609 Code e0
Length 36.83 mm
Memory Density 524288 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.89 mm
Standby Current-Max 0.05 A
Supply Current-Max 0.05 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for HN27C512G-20

This table gives cross-reference parts and alternative options found for HN27C512G-20. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HN27C512G-20, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TMS27C512-2JE 524 288-Bit Programmable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments HN27C512G-20 vs TMS27C512-2JE
NM27C512QE200 UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERDIP-28 Fairchild Semiconductor Corporation HN27C512G-20 vs NM27C512QE200
TMM27512AD-200 IC 64K X 8 UVPROM, 200 ns, CDIP28, CERDIP-28, Programmable ROM Toshiba America Electronic Components HN27C512G-20 vs TMM27512AD-200
QD27C512-200V10 UVPROM, 64KX8, 200ns, CMOS, CDIP28, CERDIP-28 Intel Corporation HN27C512G-20 vs QD27C512-200V10
TMS27C512-20JL4 64KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments HN27C512G-20 vs TMS27C512-20JL4
M27C512-20F6E 64KX8 UVPROM, 200ns, CDIP28, ROHS COMPLIANT, CERAMIC, DIP-28 STMicroelectronics HN27C512G-20 vs M27C512-20F6E
AM27C512-200DC UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C512G-20 vs AM27C512-200DC
TMS27C512-20JE 524 288-Bit Programmable Read-Only Memory 28-CDIP -40 to 85 Texas Instruments HN27C512G-20 vs TMS27C512-20JE
M27C512-20F1L 64KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics HN27C512G-20 vs M27C512-20F1L
AM27C512-200/BXA UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD HN27C512G-20 vs AM27C512-200/BXA
Part Number Description Manufacturer Compare
5962-8764801XX UVPROM, 64KX8, 150ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation HN27C512G-20 vs 5962-8764801XX
HN27512P-30 OTP ROM, 64KX8, 300ns, CMOS, PDIP28, PLASTIC, DIP-28 Hitachi Ltd HN27C512G-20 vs HN27512P-30
AT27I512R-12PI OTP ROM, 64KX8, 120ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Atmel Corporation HN27C512G-20 vs AT27I512R-12PI
AT27C512R-25PL OTP ROM, 64KX8, 250ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Atmel Corporation HN27C512G-20 vs AT27C512R-25PL
AT27C512R-90PK OTP ROM, 64KX8, 90ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Atmel Corporation HN27C512G-20 vs AT27C512R-90PK
5962-8764802XA UVPROM, 64KX8, 200ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation HN27C512G-20 vs 5962-8764802XA
AT27C515R-15PC OTP ROM, 64KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Atmel Corporation HN27C512G-20 vs AT27C515R-15PC
5962-8764803XX UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 Atmel Corporation HN27C512G-20 vs 5962-8764803XX
NM27C512QE150 IC 64K X 8 UVPROM, 150 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation HN27C512G-20 vs NM27C512QE150
HN27C512G-17 64KX8 UVPROM, 170ns, CDIP28, CERAMIC, DIP-28 Renesas Electronics Corporation HN27C512G-20 vs HN27C512G-17

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