Part Details for IM6316MJG by General Electric Solid State
Overview of IM6316MJG by General Electric Solid State
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Applications
Education and Research
Industrial Automation
Computing and Data Storage
Electronic Manufacturing
Part Details for IM6316MJG
IM6316MJG CAD Models
IM6316MJG Part Data Attributes
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IM6316MJG
General Electric Solid State
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Datasheet
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IM6316MJG
General Electric Solid State
MASK ROM, 2KX8, 600ns, CMOS, CDIP24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | GENERAL ELECTRIC SOLID STATE | |
Package Description | DIP, DIP24,.6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 600 ns | |
JESD-30 Code | R-XDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 65536 bit | |
Memory IC Type | MASK ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 8KX8 | |
Package Body Material | CERAMIC | |
Package Code | DIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.01 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |