Datasheets
IS61DDPB22M36A-500M3I by: Integrated Silicon Solution Inc

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165

Part Details for IS61DDPB22M36A-500M3I by Integrated Silicon Solution Inc

Overview of IS61DDPB22M36A-500M3I by Integrated Silicon Solution Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for IS61DDPB22M36A-500M3I

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IS61DDPB22M36A-500M3I Part Data Attributes

IS61DDPB22M36A-500M3I Integrated Silicon Solution Inc
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IS61DDPB22M36A-500M3I Integrated Silicon Solution Inc DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 500 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.36 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.96 mA
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for IS61DDPB22M36A-500M3I

This table gives cross-reference parts and alternative options found for IS61DDPB22M36A-500M3I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61DDPB22M36A-500M3I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS61DDPB22M36A2-500M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A-500M3I vs IS61DDPB22M36A2-500M3LI
IS61DDPB22M36A1-500M3I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A-500M3I vs IS61DDPB22M36A1-500M3I
IS61DDPB22M36A-500M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A-500M3I vs IS61DDPB22M36A-500M3LI
IS61DDPB22M36A1-500M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.20 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A-500M3I vs IS61DDPB22M36A1-500M3LI
Part Number Description Manufacturer Compare
IS61QDP2B42M36A1-300M3L QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A-500M3I vs IS61QDP2B42M36A1-300M3L
GS8662D36BGD-400IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A-500M3I vs GS8662D36BGD-400IT
GS8662D36BD-350I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDPB22M36A-500M3I vs GS8662D36BD-350I
GS8662D36BGD-350 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A-500M3I vs GS8662D36BGD-350
GS8662Q36BD-357I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDPB22M36A-500M3I vs GS8662Q36BD-357I
GS8662D36BGD-350IT QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A-500M3I vs GS8662D36BGD-350IT
CY7C2565KV18-450BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor IS61DDPB22M36A-500M3I vs CY7C2565KV18-450BZI
CY7C2565KV18-400BZI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 Cypress Semiconductor IS61DDPB22M36A-500M3I vs CY7C2565KV18-400BZI
GS8662D36BGD-350I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A-500M3I vs GS8662D36BGD-350I
CY7C1545KV18-400BZXI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG IS61DDPB22M36A-500M3I vs CY7C1545KV18-400BZXI

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