Datasheets
IS61DDPB22M36A2-400M3L by: Integrated Silicon Solution Inc

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165

Part Details for IS61DDPB22M36A2-400M3L by Integrated Silicon Solution Inc

Overview of IS61DDPB22M36A2-400M3L by Integrated Silicon Solution Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Part Details for IS61DDPB22M36A2-400M3L

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IS61DDPB22M36A2-400M3L Part Data Attributes

IS61DDPB22M36A2-400M3L Integrated Silicon Solution Inc
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IS61DDPB22M36A2-400M3L Integrated Silicon Solution Inc DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description LBGA, BGA165,11X15,40
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.32 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.8 mA
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 15 mm

Alternate Parts for IS61DDPB22M36A2-400M3L

This table gives cross-reference parts and alternative options found for IS61DDPB22M36A2-400M3L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61DDPB22M36A2-400M3L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY7C25702KV18-400BZC DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 MM X 13 MM, 1.4 MM HEIGHT, MO-216,FBGA-165 Cypress Semiconductor IS61DDPB22M36A2-400M3L vs CY7C25702KV18-400BZC
IS61DDPB22M36A1-400M3 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A2-400M3L vs IS61DDPB22M36A1-400M3
IS61DDPB22M36A2-400M3 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A2-400M3L vs IS61DDPB22M36A2-400M3
IS61DDPB22M36A-400M3 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDPB22M36A2-400M3L vs IS61DDPB22M36A-400M3
Part Number Description Manufacturer Compare
CY7C1565KV18-400BZXC QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Infineon Technologies AG IS61DDPB22M36A2-400M3L vs CY7C1565KV18-400BZXC
GS8662TT38BD-350 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662TT38BD-350
CY7C25702KV18-400BZC DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 MM X 13 MM, 1.4 MM HEIGHT, MO-216,FBGA-165 Cypress Semiconductor IS61DDPB22M36A2-400M3L vs CY7C25702KV18-400BZC
GS8662TT37BGD-350IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662TT37BGD-350IT
CY7C25702KV18-500BZC DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 MM X 13 MM, 1.4 MM HEIGHT, MO-216,FBGA-165 Cypress Semiconductor IS61DDPB22M36A2-400M3L vs CY7C25702KV18-500BZC
GS8662TT38BGD-450 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662TT38BGD-450
GS8662TT38BGD-350IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662TT38BGD-350IT
GS8662TT37BGD-400 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662TT37BGD-400
GS8662QT37BGD-357T QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662QT37BGD-357T
GS8662TT38BD-350I DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDPB22M36A2-400M3L vs GS8662TT38BD-350I

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