Part Details for IS61QDB22M36A-250M3L by Integrated Silicon Solution Inc
Overview of IS61QDB22M36A-250M3L by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for IS61QDB22M36A-250M3L
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
77T0726
|
Newark | 72Mb, Quad (Burst Of 2), Sync Sram, 2M X 36, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61QDB22M36A-250M3L Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$66.5600 | Buy Now |
|
DISTI #
IS61QDB22M36A-250M3L-ND
|
DigiKey | IC SRAM 72MBIT PARALLEL 165LFBGA Min Qty: 105 Lead time: 26 Weeks Container: Tray | Temporarily Out of Stock |
|
$70.3784 | Buy Now |
|
DISTI #
IS61QDB22M36A-250M
|
Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin FBGA - Bulk (Alt: IS61QDB22M36A-250M) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 28 Weeks, 0 Days Container: Bulk | 0 |
|
$65.0000 / $79.5600 | Buy Now |
|
DISTI #
870-61QD22M36A250M3L
|
Mouser Electronics | SRAM 72Mb, QUAD (Burst of 2), Sync SRAM, 2M x 36, 165 Ball FBGA (15x17 mm), RoHS RoHS: Compliant | 0 |
|
$68.3200 | Order Now |
Part Details for IS61QDB22M36A-250M3L
IS61QDB22M36A-250M3L CAD Models
IS61QDB22M36A-250M3L Part Data Attributes:
|
|
IS61QDB22M36A-250M3L
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS61QDB22M36A-250M3L
Integrated Silicon Solution Inc
QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 28 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 17 mm | |
| Memory Density | 75497472 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 2MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 1 mA | |
| Supply Voltage-Max (Vsup) | 1.89 V | |
| Supply Voltage-Min (Vsup) | 1.71 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for IS61QDB22M36A-250M3L
This table gives cross-reference parts and alternative options found for IS61QDB22M36A-250M3L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61QDB22M36A-250M3L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1514KV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3L vs CY7C1514KV18-250BZXC |
| CY7C1514AV18-250BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3L vs CY7C1514AV18-250BZC |
| GS8662Q36BD-250 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | IS61QDB22M36A-250M3L vs GS8662Q36BD-250 |
| CY7C1514JV18-250BZXC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3L vs CY7C1514JV18-250BZXC |
| GS8672Q36BGE-250 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | IS61QDB22M36A-250M3L vs GS8672Q36BGE-250 |
| CY7C1514JV18-250BZC | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | IS61QDB22M36A-250M3L vs CY7C1514JV18-250BZC |
| K7R643682M-FC250 | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165 | Samsung Semiconductor | IS61QDB22M36A-250M3L vs K7R643682M-FC250 |
| GS8672Q36BE-250 | Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | IS61QDB22M36A-250M3L vs GS8672Q36BE-250 |
| GS8662Q36BD-250T | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | IS61QDB22M36A-250M3L vs GS8662Q36BD-250T |
| GS8662Q36BGD-250T | QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | IS61QDB22M36A-250M3L vs GS8662Q36BGD-250T |