There are no models available for this part yet.
Overview of IS66WV51216ALL-70BLI by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for IS66WV51216ALL-70BLI by Integrated Silicon Solution Inc
Part Data Attributes for IS66WV51216ALL-70BLI by Integrated Silicon Solution Inc
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|
|
|---|---|
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Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
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|
Part Package Code
|
BGA
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|
Package Description
|
TFBGA, BGA48,6X8,30
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Pin Count
|
48
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Reach Compliance Code
|
compliant
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ECCN Code
|
3A991.B.2.A
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HTS Code
|
8542.32.00.41
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Access Time-Max
|
70 ns
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I/O Type
|
COMMON
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JESD-30 Code
|
R-PBGA-B48
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|
JESD-609 Code
|
e1
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Length
|
8 mm
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Memory Density
|
8388608 bit
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Memory IC Type
|
PSEUDO STATIC RAM
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|
Memory Width
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16
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Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Terminals
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48
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Number of Words
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524288 words
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Number of Words Code
|
512000
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Operating Mode
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ASYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
512KX16
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Output Characteristics
|
3-STATE
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
TFBGA
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Package Equivalence Code
|
BGA48,6X8,30
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Package Shape
|
RECTANGULAR
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Parallel/Serial
|
PARALLEL
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|
Peak Reflow Temperature (Cel)
|
260
|
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Qualification Status
|
Not Qualified
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|
Seated Height-Max
|
1.2 mm
|
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Standby Current-Max
|
0.0001 A
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Supply Current-Max
|
0.025 mA
|
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Supply Voltage-Max (Vsup)
|
1.95 V
|
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Supply Voltage-Min (Vsup)
|
1.7 V
|
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Supply Voltage-Nom (Vsup)
|
1.8 V
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Surface Mount
|
YES
|
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Technology
|
CMOS
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Temperature Grade
|
INDUSTRIAL
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Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
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Terminal Form
|
BALL
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Terminal Pitch
|
0.75 mm
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Terminal Position
|
BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
10
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Width
|
6 mm
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Alternate Parts for IS66WV51216ALL-70BLI
This table gives cross-reference parts and alternative options found for IS66WV51216ALL-70BLI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS66WV51216ALL-70BLI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HY62QF16804A-SM10C | Standard SRAM, 512KX16, 100ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | IS66WV51216ALL-70BLI vs HY62QF16804A-SM10C |
| K6F8016S6A-EF70 | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 7 X 9 MM, 0.75 MM PITCH, TBGA-48 | Samsung Semiconductor | IS66WV51216ALL-70BLI vs K6F8016S6A-EF70 |
| CY62157CV30LL-55BAI | Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, 6 X 10 MM, 1.20 MM HEIGHT, FBGA-48 | Cypress Semiconductor | IS66WV51216ALL-70BLI vs CY62157CV30LL-55BAI |
| HY62UF16803ASLM-85I | Standard SRAM, 512KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | IS66WV51216ALL-70BLI vs HY62UF16803ASLM-85I |
| CY62157DV30LL-55BVIT | Standard SRAM, 512KX16, 55ns, CMOS, PBGA48 | Cypress Semiconductor | IS66WV51216ALL-70BLI vs CY62157DV30LL-55BVIT |
| HY62UF16803ASLM-70I | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | IS66WV51216ALL-70BLI vs HY62UF16803ASLM-70I |
| HM62V16512LBPI-5SL | Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, 0.75 MM PITCH, CSP-48 | Hitachi Ltd | IS66WV51216ALL-70BLI vs HM62V16512LBPI-5SL |
| HY62UF16806B-DF55C | Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, FBGA-48 | SK Hynix Inc | IS66WV51216ALL-70BLI vs HY62UF16806B-DF55C |
| HY62SF16804B-SF70C | Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, FBGA-48 | SK Hynix Inc | IS66WV51216ALL-70BLI vs HY62SF16804B-SF70C |
| CY14B108N-BA45XCT | Non-Volatile SRAM, 512KX16, 45ns, CMOS, PBGA48, 6 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-48 | Cypress Semiconductor | IS66WV51216ALL-70BLI vs CY14B108N-BA45XCT |