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ISO7763FDBQ by:
Texas Instruments

CMOS, PDSO16

Part Details for ISO7763FDBQ by Texas Instruments

Results Overview of ISO7763FDBQ by Texas Instruments

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ISO7763FDBQ Information

ISO7763FDBQ by Texas Instruments is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for ISO7763FDBQ

Part # Distributor Description Stock Price Buy
DISTI # 296-48817-ND
DigiKey DGTL ISOLTR 3KV 6CH GP 16-SSOP Min Qty: 1 Container: Tube 72
Tube
  • 1 $4.9300
  • 10 $3.7480
$3.7480 / $4.9300 Buy Now
Chip Stock Robust EMC, six-channel, 3/3, reinforced digital isolator 16-SSOP -55 to 125 27264
RFQ

US Tariff Estimator: ISO7763FDBQ by Texas Instruments

Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.

ISO7763FDBQ
Texas Instruments
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Part Details for ISO7763FDBQ

ISO7763FDBQ CAD Models

ISO7763FDBQ Part Data Attributes

ISO7763FDBQ Texas Instruments
Buy Now Datasheet
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ISO7763FDBQ Texas Instruments CMOS, PDSO16
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Package Description Ssop-16
ECCN Code EAR99
HTS Code 8542.39.00.60
Date Of Intro 2018-01-30
Additional Feature Also Required Vcc2 2.25-5.5v Supply; Also Operate With 3.3v And 5v Supply
Interface IC Type Digital Isolator
JESD-30 Code R-PDSO-G16
JESD-609 Code e4
Length 4.905 Mm
Moisture Sensitivity Level 2
Number of Channels 6
Number of Functions 6
Number of Terminals 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material Plastic/Epoxy
Package Code SSOP
Package Equivalence Code SSOP16,.25
Package Shape Rectangular
Package Style Small Outline, Shrink Pitch
Peak Reflow Temperature (Cel) 260
Screening Level Iec 62368-1; Iec 61010-1
Seated Height-Max 1.75 Mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 2.25 V
Supply Voltage-Nom 2.5 V
Surface Mount Yes
Technology Cmos
Temperature Grade Military
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form Gull Wing
Terminal Pitch 0.635 Mm
Terminal Position Dual
Time@Peak Reflow Temperature-Max (s) 30
Width 3.895 Mm

Alternate Parts for ISO7763FDBQ

This table gives cross-reference parts and alternative options found for ISO7763FDBQ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ISO7763FDBQ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
ISO7763DBQ Texas Instruments $2.1716 CMOS, PDSO16 ISO7763FDBQ vs ISO7763DBQ
ISO7763FQDWRQ1 Texas Instruments $2.2620 DIGITAL ISOLATOR, CMOS, PDSO16 ISO7763FDBQ vs ISO7763FQDWRQ1
ISO7763QDBQQ1 Texas Instruments $2.2620 CMOS, PDSO16 ISO7763FDBQ vs ISO7763QDBQQ1
ISO7763DW Texas Instruments $2.5892 CMOS, PDSO16 ISO7763FDBQ vs ISO7763DW
ISO7763FDW Texas Instruments $2.5893 CMOS, PDSO16 ISO7763FDBQ vs ISO7763FDW
ISO7763QDWQ1 Texas Instruments $2.6240 CMOS, PDSO16 ISO7763FDBQ vs ISO7763QDWQ1
ISO7763FQDWQ1 Texas Instruments Check for Price CMOS, PDSO16 ISO7763FDBQ vs ISO7763FQDWQ1
ISO7763QDBQRQ1 Texas Instruments Check for Price DIGITAL ISOLATOR, CMOS, PDSO16 ISO7763FDBQ vs ISO7763QDBQRQ1
equivalents icon

ISO7763FDBQ Frequently Asked Questions (FAQ)

  • The maximum data rate is 100 Mbps, but it can be limited by the capacitance of the isolation barrier and the signal integrity of the system.

  • Ensure proper thermal management, use a thermally conductive material for the PCB, and follow the recommended layout and thermal design guidelines.

  • Use a multi-layer PCB, keep the signal traces short and away from the isolation barrier, and use a ground plane to reduce EMI.

  • Ensure that the VCC1 and VCC2 power supplies are powered up and down simultaneously, and that the input signals are stable before enabling the device.

  • Use a logic analyzer or oscilloscope to monitor the input and output signals, and use a signal generator to test the device's functionality.

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