Part Details for K6F2016S4D-FF700 by Samsung Semiconductor
Overview of K6F2016S4D-FF700 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for K6F2016S4D-FF700
K6F2016S4D-FF700 CAD Models
K6F2016S4D-FF700 Part Data Attributes
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K6F2016S4D-FF700
Samsung Semiconductor
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Datasheet
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K6F2016S4D-FF700
Samsung Semiconductor
Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 7 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 6 mm |
Alternate Parts for K6F2016S4D-FF700
This table gives cross-reference parts and alternative options found for K6F2016S4D-FF700. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K6F2016S4D-FF700, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HY62EF8400ASLM-12I | Standard SRAM, 512KX8, 120ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | K6F2016S4D-FF700 vs HY62EF8400ASLM-12I |
| CY62146CV18LL-55BAIT | Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, 7 X 8.50 MM, 1.20 MM HEIGHT, FBGA-48 | Cypress Semiconductor | K6F2016S4D-FF700 vs CY62146CV18LL-55BAIT |
| V62C2184096L-55B | Standard SRAM, 512KX8, 55ns, CMOS, PBGA48, 8 X 10 MM, CSP, FBGA-48 | Mosel Vitelic Corporation | K6F2016S4D-FF700 vs V62C2184096L-55B |
| V62C2162048LL-35TI | Standard SRAM, 128KX16, 35ns, CMOS, PDSO44, TSOP2-44 | Mosel Vitelic Corporation | K6F2016S4D-FF700 vs V62C2162048LL-35TI |
| IS62UT12816LL-55B | Standard SRAM, 128KX16, 55ns, CMOS, PBGA48, MINI, BGA-48 | Integrated Silicon Solution Inc | K6F2016S4D-FF700 vs IS62UT12816LL-55B |
| HY62QF16201ASLM-85 | Standard SRAM, 128KX16, 85ns, CMOS, PBGA48, MICRO, CSP, BGA-48 | SK Hynix Inc | K6F2016S4D-FF700 vs HY62QF16201ASLM-85 |
| V62C3162096L-35B | Standard SRAM, 128KX16, 35ns, CMOS, PBGA48, 9 X 12 MM, FBGA-48 | Mosel Vitelic Corporation | K6F2016S4D-FF700 vs V62C3162096L-35B |
| HY62QF16201ASLM-70I | Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, MICRO, CSP, BGA-48 | SK Hynix Inc | K6F2016S4D-FF700 vs HY62QF16201ASLM-70I |
| IS62UT12816SL-70B | Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, MINI, BGA-48 | Integrated Silicon Solution Inc | K6F2016S4D-FF700 vs IS62UT12816SL-70B |
| V62C21162048L-70BI | Standard SRAM, 128KX16, 70ns, CMOS, PBGA48, 9 X 12 MM, FBGA-48 | Mosel Vitelic Corporation | K6F2016S4D-FF700 vs V62C21162048L-70BI |