Part Details for K6F4016U4D-FF550 by Samsung Semiconductor
Overview of K6F4016U4D-FF550 by Samsung Semiconductor
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
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Part Details for K6F4016U4D-FF550
K6F4016U4D-FF550 CAD Models
K6F4016U4D-FF550 Part Data Attributes
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K6F4016U4D-FF550
Samsung Semiconductor
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Datasheet
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K6F4016U4D-FF550
Samsung Semiconductor
Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| JESD-30 Code | R-PBGA-B48 | |
| Length | 8.5 mm | |
| Memory Density | 4194304 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Width | 6.1 mm |
Alternate Parts for K6F4016U4D-FF550
This table gives cross-reference parts and alternative options found for K6F4016U4D-FF550. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K6F4016U4D-FF550, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HY62EF8400ASLM-12I | Standard SRAM, 512KX8, 120ns, CMOS, PBGA48, MICRO, BGA-48 | SK Hynix Inc | K6F4016U4D-FF550 vs HY62EF8400ASLM-12I |
| CY62146CV18LL-55BAIT | Standard SRAM, 256KX16, 55ns, CMOS, PBGA48, 7 X 8.50 MM, 1.20 MM HEIGHT, FBGA-48 | Cypress Semiconductor | K6F4016U4D-FF550 vs CY62146CV18LL-55BAIT |
| V62C3162096LL-45BI | Standard SRAM, 128KX16, 45ns, CMOS, PBGA48, 9 X 12 MM, FBGA-48 | Mosel Vitelic Corporation | K6F4016U4D-FF550 vs V62C3162096LL-45BI |
| K6F4008U2D-FF700 | Standard SRAM, 512KX8, 70ns, CMOS, PBGA48, 6.10 X 8.50 MM, 0.75 MM PITCH, FBGA-48 | Samsung Semiconductor | K6F4016U4D-FF550 vs K6F4008U2D-FF700 |
| IS64LV25616AL-10BA1 | Standard SRAM, 256KX16, 10ns, CMOS, PBGA48, 8 X 10 MM, MINI, BGA-48 | Integrated Silicon Solution Inc | K6F4016U4D-FF550 vs IS64LV25616AL-10BA1 |
| V62C31162048LL-35TI | Standard SRAM, 128KX16, 35ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44 | Mosel Vitelic Corporation | K6F4016U4D-FF550 vs V62C31162048LL-35TI |
| IS62UP25616SL-100BI | Standard SRAM, 256KX16, 100ns, CMOS, PBGA48, MINI, BGA-48 | Integrated Silicon Solution Inc | K6F4016U4D-FF550 vs IS62UP25616SL-100BI |
| V62C2184096LL-85B | Standard SRAM, 512KX8, 85ns, CMOS, PBGA36, 8 X 10 MM, CSP, BGA-36 | Mosel Vitelic Corporation | K6F4016U4D-FF550 vs V62C2184096LL-85B |
| MSM8V512CB-015/48D | Standard SRAM, 512KX8, 15ns, CMOS, PBGA48, 10 X 8 X 1.4 MM, CHIP SIZE, BGA-48 | APTA Group Inc | K6F4016U4D-FF550 vs MSM8V512CB-015/48D |
| V62C31162048L-35KI | Standard SRAM, 128KX16, 35ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Mosel Vitelic Corporation | K6F4016U4D-FF550 vs V62C31162048L-35KI |