Datasheets
K6F8016R6M-FF70 by: Samsung Semiconductor

Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 8 X 12 MM, 0.75 MM PITCH, FBGA-48

Part Details for K6F8016R6M-FF70 by Samsung Semiconductor

Overview of K6F8016R6M-FF70 by Samsung Semiconductor

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Part Details for K6F8016R6M-FF70

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K6F8016R6M-FF70 Part Data Attributes

K6F8016R6M-FF70 Samsung Semiconductor
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K6F8016R6M-FF70 Samsung Semiconductor Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 8 X 12 MM, 0.75 MM PITCH, FBGA-48
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA
Package Description TFBGA, BGA48,6X8,30
Pin Count 48
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B48
JESD-609 Code e0
Length 12 mm
Memory Density 8388608 bit
Memory IC Type STANDARD SRAM
Memory Width 16
Number of Functions 1
Number of Terminals 48
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Voltage-Min 1 V
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 2.2 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for K6F8016R6M-FF70

This table gives cross-reference parts and alternative options found for K6F8016R6M-FF70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K6F8016R6M-FF70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
K6F8016R6C-FF700 Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48 Samsung Semiconductor K6F8016R6M-FF70 vs K6F8016R6C-FF700
Part Number Description Manufacturer Compare
CY62157EV30LL-45BVXI Standard SRAM, 512KX16, 45ns, CMOS, PBGA48, VFBGA-48 Cypress Semiconductor K6F8016R6M-FF70 vs CY62157EV30LL-45BVXI
STK14EE16-BF45TR 512K X 16 NON-VOLATILE SRAM, 45 ns, PBGA48, PLASTIC, FBGA-48 Cypress Semiconductor K6F8016R6M-FF70 vs STK14EE16-BF45TR
TC55YEM316AXGN55 IC 512K X 16 STANDARD SRAM, 70 ns, PBGA48, 8 X 11 MM, 0.75 MM PITCH, LEAD FREE, PLASTIC, TFBGA-48, Static RAM Toshiba America Electronic Components K6F8016R6M-FF70 vs TC55YEM316AXGN55
STK14EE16-BF25I Non-Volatile SRAM, 512KX16, 25ns, CMOS, PBGA48, PLASTIC, FBGA-48 Simtek Corporation K6F8016R6M-FF70 vs STK14EE16-BF25I
CY62157CV33LL-70BAIT Standard SRAM, 512KX16, 70ns, CMOS, PBGA48, 6 X 10 MM, 1.20 MM HEIGHT, FBGA-48 Cypress Semiconductor K6F8016R6M-FF70 vs CY62157CV33LL-70BAIT
HY62UF16806A-SM55I Standard SRAM, 512KX16, 55ns, CMOS, PBGA48, MICRO, BGA-48 SK Hynix Inc K6F8016R6M-FF70 vs HY62UF16806A-SM55I
M68AW512DL70ZB6 512KX16 STANDARD SRAM, 70ns, PBGA48, 8 X 10 MM, 0.75 MM PITCH, TFBGA-48 STMicroelectronics K6F8016R6M-FF70 vs M68AW512DL70ZB6
HY62UF16804A-DM85C Standard SRAM, 512KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48 SK Hynix Inc K6F8016R6M-FF70 vs HY62UF16804A-DM85C
HY62QF16804A-DM85C Standard SRAM, 512KX16, 85ns, CMOS, PBGA48, MICRO, BGA-48 SK Hynix Inc K6F8016R6M-FF70 vs HY62QF16804A-DM85C
CY14E108N-BA20XCT Non-Volatile SRAM, 512KX16, 20ns, CMOS, PBGA48, 6 X 10 MM, 1.20 MM HEIGHT, ROHS COMPLIANT, FBGA-48 Cypress Semiconductor K6F8016R6M-FF70 vs CY14E108N-BA20XCT

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