Part Details for K7R323684M-FC25 by Samsung Semiconductor
Overview of K7R323684M-FC25 by Samsung Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| DLFC25 | Coilcraft Inc | Rectangular Connector Adapter, 25 Contacts(Side1), 25 Contacts(Side2), Panel Mount, Male-Female | |
| DF2338VFC25IV | Renesas Electronics Corporation | Microcontrollers for General Purpose System Control Applications (Non Promotion) | |
| DF2339VFC25IV | Renesas Electronics Corporation | Microcontrollers for General Purpose System Control Applications (Non Promotion) |
Part Details for K7R323684M-FC25
K7R323684M-FC25 CAD Models
K7R323684M-FC25 Part Data Attributes
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K7R323684M-FC25
Samsung Semiconductor
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Datasheet
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K7R323684M-FC25
Samsung Semiconductor
QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | SAMSUNG SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | LBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e0 | |
| Length | 17 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.33 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.8 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 15 mm |
Alternate Parts for K7R323684M-FC25
This table gives cross-reference parts and alternative options found for K7R323684M-FC25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K7R323684M-FC25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1415AV18-250BZXI | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7R323684M-FC25 vs CY7C1415AV18-250BZXI |
| UPD44325364F5-E40-EQ2-A | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, PLASTIC, BGA-165 | NEC Electronics Group | K7R323684M-FC25 vs UPD44325364F5-E40-EQ2-A |
| CY7C1415BV18-250BZXC | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | K7R323684M-FC25 vs CY7C1415BV18-250BZXC |
| CY7C1415BV18-250BZC | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | K7R323684M-FC25 vs CY7C1415BV18-250BZC |
| CY7C1415AV18-250BZI | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | K7R323684M-FC25 vs CY7C1415AV18-250BZI |
| CY7C1415BV18-250BZI | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, M0-216, FBGA-165 | Cypress Semiconductor | K7R323684M-FC25 vs CY7C1415BV18-250BZI |
| UPD44325364F5-E40-EQ2 | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, PLASTIC, FBGA-165 | NEC Electronics Group | K7R323684M-FC25 vs UPD44325364F5-E40-EQ2 |
| CY7C1415BV18-250BZXI | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, M0-216, FBGA-165 | Cypress Semiconductor | K7R323684M-FC25 vs CY7C1415BV18-250BZXI |
| CY7C1415KV18-250BZXC | QDR SRAM, 1MX36, 0.45ns, CMOS, PBGA165, FBGA-165 | Infineon Technologies AG | K7R323684M-FC25 vs CY7C1415KV18-250BZXC |