Part Details for KMPC860DEZQ50D4 by Freescale Semiconductor
Overview of KMPC860DEZQ50D4 by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for KMPC860DEZQ50D4
KMPC860DEZQ50D4 CAD Models
KMPC860DEZQ50D4 Part Data Attributes
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KMPC860DEZQ50D4
Freescale Semiconductor
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Datasheet
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KMPC860DEZQ50D4
Freescale Semiconductor
32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | |
Pin Count | 357 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 5A991 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 50 MHz | |
External Data Bus Width | 32 | |
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B357 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 357 | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA357,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 245 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.52 mm | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.465 V | |
Supply Voltage-Min | 3.135 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for KMPC860DEZQ50D4
This table gives cross-reference parts and alternative options found for KMPC860DEZQ50D4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KMPC860DEZQ50D4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TSPC860MHVZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | KMPC860DEZQ50D4 vs TSPC860MHVZPU50B |
MPC860DEZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | KMPC860DEZQ50D4 vs MPC860DEZQ50D4 |
MPC860DPZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | KMPC860DEZQ50D4 vs MPC860DPZQ50D4 |
XPC855TCZP50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | KMPC860DEZQ50D4 vs XPC855TCZP50D4 |
TSXPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | KMPC860DEZQ50D4 vs TSXPC860MHVZPU50C1 |
XPC862DPCZP50 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | KMPC860DEZQ50D4 vs XPC862DPCZP50 |
TSXPC860SRMZPU50B | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | KMPC860DEZQ50D4 vs TSXPC860SRMZPU50B |
XPC860ENZP50D3 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | KMPC860DEZQ50D4 vs XPC860ENZP50D3 |
MPC860SRVR50D4R2 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | KMPC860DEZQ50D4 vs MPC860SRVR50D4R2 |
KMPC860DTZQ50D4 | 32-BIT, 50 MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | Freescale Semiconductor | KMPC860DEZQ50D4 vs KMPC860DTZQ50D4 |