Part Details for L7C108KMB12 by LOGIC Devices Inc
Overview of L7C108KMB12 by LOGIC Devices Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Environmental Monitoring
Industrial Automation
Part Details for L7C108KMB12
L7C108KMB12 CAD Models
L7C108KMB12 Part Data Attributes
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L7C108KMB12
LOGIC Devices Inc
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Datasheet
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L7C108KMB12
LOGIC Devices Inc
Standard SRAM, 128KX8, 12ns, CMOS, CQCC32, CERAMIC, LCC-32
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | LOGIC DEVICES INC | |
Part Package Code | QFJ | |
Package Description | QCCN, | |
Pin Count | 32 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 12 ns | |
Additional Feature | AUTOMATIC POWER DOWN; BATTERY BACKUP | |
JESD-30 Code | R-CQCC-N32 | |
Length | 17.78 mm | |
Memory Density | 1048576 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 131072 words | |
Number of Words Code | 128000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 128KX8 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | QCCN | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.54 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.43 mm |
Alternate Parts for L7C108KMB12
This table gives cross-reference parts and alternative options found for L7C108KMB12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of L7C108KMB12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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L7C109YMB12 | Standard SRAM, 128KX8, 12ns, CMOS, CDSO32, 0.440 INCH, CERAMIC, SOJ-32 | LOGIC Devices Inc | L7C108KMB12 vs L7C109YMB12 |
L7C108DC12L | Standard SRAM, 128KX8, 12ns, CMOS, CDIP32, 0.400 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-32 | LOGIC Devices Inc | L7C108KMB12 vs L7C108DC12L |
AP9A110L-12VI | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32 | Integrated Silicon Solution Inc | L7C108KMB12 vs AP9A110L-12VI |
IS61C1024L-12KR | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | Integrated Silicon Solution Inc | L7C108KMB12 vs IS61C1024L-12KR |
EK681024MJ-12 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32 | Eureka Microelectronics Inc | L7C108KMB12 vs EK681024MJ-12 |
IS61C1024L-12TRI | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, TSOP1-32 | Integrated Silicon Solution Inc | L7C108KMB12 vs IS61C1024L-12TRI |
KM681002CLT-1200 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, TSOP2-32 | Samsung Semiconductor | L7C108KMB12 vs KM681002CLT-1200 |
L7C108WC12 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, SOJ-32 | LOGIC Devices Inc | L7C108KMB12 vs L7C108WC12 |
IS61C1024-12MRI | Standard SRAM, 128KX8, 12ns, CMOS, PDIP32, 0.400 INCH, PLASTIC, DIP-32 | Integrated Silicon Solution Inc | L7C108KMB12 vs IS61C1024-12MRI |
PDM41034LA12TTY | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32 | Paradigm Technology Inc | L7C108KMB12 vs PDM41034LA12TTY |