Part Details for LE82GM965 by Intel Corporation
Overview of LE82GM965 by Intel Corporation
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Applications
Consumer Electronics
Computing and Data Storage
Part Details for LE82GM965
LE82GM965 CAD Models
LE82GM965 Part Data Attributes:
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LE82GM965
Intel Corporation
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Datasheet
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LE82GM965
Intel Corporation
DRAM Controller, 256M X 64, CMOS, PBGA1299, FCBGA-1299
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | BGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 4A994 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 15 | |
| Boundary Scan | NO | |
| Bus Compatibility | ATA, I2C, ISA, LPC, PCI, SIO, SMBUS, SPI, USB | |
| External Data Bus Width | 64 | |
| JESD-30 Code | S-PBGA-B1299 | |
| Length | 35 mm | |
| Low Power Mode | YES | |
| Memory Organization | 256M X 64 | |
| Number of Banks | 8 | |
| Number of Terminals | 1299 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Seated Height-Max | 1.73 mm | |
| Supply Voltage-Max | 1.1025 V | |
| Supply Voltage-Min | 0.9975 V | |
| Supply Voltage-Nom | 1.05 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| Width | 35 mm | |
| uPs/uCs/Peripheral ICs Type | MEMORY CONTROLLER, DRAM |