Datasheets
LPC1313FHN33,551 by: NXP Semiconductors

LPC1313FHN33 - 32kB Flash, 8kB SRAM QFN 32-Pin

Part Details for LPC1313FHN33,551 by NXP Semiconductors

Overview of LPC1313FHN33,551 by NXP Semiconductors

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Price & Stock for LPC1313FHN33,551

Part # Distributor Description Stock Price Buy
DISTI # 27AC7928
Newark Entry-Level 32-Bit Microcontroller (Mcu) Based On Arm Cortex-M3 Core Rohs Compliant: Yes |Nxp LPC1313FHN33,551 Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 250 $2.2500
  • 520 $2.2200
$2.2200 / $2.2500 Buy Now
DISTI # 70R5588
Newark Microcontroller Mcu, 32 Bit, Cortex-M3, 72Mhz, Hvqfn-33, Product Range:Lpc1300 Arm Cortex-M3 Microcontrollers, Device Core:Arm Cortex-M3, Data Bus Width:32 Bit, Operating Frequency Max:72Mhz, Program Memory Size:32Kb, Qualification:-Rohs Compliant: Yes |Nxp LPC1313FHN33,551 Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 250 $2.3000
  • 520 $2.2700
$2.2700 / $2.3000 Buy Now
DISTI # 568-4913-ND
DigiKey IC MCU 32BIT 32KB FLASH 32VQFN Min Qty: 1 Lead time: 13 Weeks Container: Tray 39200
In Stock
  • 1 $5.6900
  • 10 $4.4460
  • 80 $3.6424
  • 520 $3.5658
  • 1,040 $3.0073
  • 2,600 $2.8569
$2.8569 / $5.6900 Buy Now
DISTI # LPC1313FHN33,551
Avnet Americas MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1313FHN33,551) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # 771-LPC1313FHN33,551
Mouser Electronics ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 MCU RoHS: Compliant 0
  • 1 $5.6800
  • 10 $4.4400
  • 100 $3.6400
  • 260 $3.6200
  • 520 $3.5600
  • 1,040 $3.0000
  • 2,600 $2.8500
$2.8500 / $5.6800 Order Now
Future Electronics LPC13xx Series 32 kB Flash 8 kB RAM SMT 32-Bit-Microcontroller - HVQFN-33 RoHS: Compliant pbFree: Yes Min Qty: 260 Package Multiple: 1 Container: Tray 3120
Tray
  • 260 $3.1100
  • 520 $3.0600
  • 780 $3.0300
  • 1,040 $3.0100
  • 1,300 $2.9500
$2.9500 / $3.1100 Buy Now
DISTI # LPC1313FHN33,551
Avnet Americas MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1313FHN33,551) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray 0
RFQ
DISTI # LPC1313FHN33.551
TME IC: ARM microcontroller, 8kBSRAM,32kBFLASH, VQFN32, 2÷3.6VDC Min Qty: 1 60
  • 1 $4.5300
  • 5 $4.1500
  • 25 $3.6100
  • 100 $3.1800
$3.1800 / $4.5300 Buy Now
DISTI # LPC1313FHN33,551
Avnet Silica MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray (Alt: LPC1313FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days Silica - 0
Buy Now
DISTI # LPC1313FHN33,551
EBV Elektronik MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray (Alt: LPC1313FHN33,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days EBV - 520
Buy Now

Part Details for LPC1313FHN33,551

LPC1313FHN33,551 CAD Models

LPC1313FHN33,551 Part Data Attributes:

LPC1313FHN33,551 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
LPC1313FHN33,551 NXP Semiconductors LPC1313FHN33 - 32kB Flash, 8kB SRAM QFN 32-Pin
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFN
Package Description HVQFN-33
Pin Count 32
Manufacturer Package Code SOT865-3
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family ARM7
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PQCC-N33
JESD-609 Code e4
Length 7 mm
Moisture Sensitivity Level 3
Number of I/O Lines 28
Number of Terminals 33
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code HVQCCN
Package Equivalence Code LCC32,.27SQ,25
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 8192
ROM (words) 32768
ROM Programmability FLASH
Seated Height-Max 1 mm
Speed 72 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD
Terminal Pitch 0.65 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER

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