Part Details for LPC1810FET100,551 by NXP Semiconductors
Overview of LPC1810FET100,551 by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LPC1810FET100,551
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
41T4102
|
Newark | High Performance 32-Bit Microcontroller Based On Arm Cortex-M3/Tray Rohs Compliant: Yes |Nxp LPC1810FET100,551 Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$5.6000 / $5.7700 | Buy Now |
|
DISTI #
LPC1810FET100,551-ND
|
DigiKey | IC MCU 32BIT ROMLESS 100TFBGA Min Qty: 260 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
|
$7.3980 | Buy Now |
|
DISTI #
LPC1810FET100,551
|
Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC1810FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$5.1026 / $5.8845 | Buy Now |
|
DISTI #
771-LPC1810FET100551
|
Mouser Electronics | ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US RoHS: Compliant | 0 |
|
$6.4000 / $6.6400 | Order Now |
|
|
Future Electronics | LPC18xx Series 136 kB RAM 180 MHz SMT 32-Bit-Microcontroller - TFBGA-100 RoHS: Compliant pbFree: Yes Min Qty: 260 Package Multiple: 260 Container: Tray | 0Tray |
|
$7.2600 | Buy Now |
|
DISTI #
LPC1810FET100,551
|
Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC1810FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$5.1026 / $5.8845 | Buy Now |
|
DISTI #
LPC1810FET100,551
|
Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC1810FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$5.1026 / $5.8845 | Buy Now |
|
DISTI #
LPC1810FET100,551
|
Avnet Silica | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray (Alt: LPC1810FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 2 Weeks, 1 Days | Silica - 0 |
|
Buy Now | |
|
DISTI #
LPC1810FET100,551
|
EBV Elektronik | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray (Alt: LPC1810FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 2 Weeks, 1 Days | EBV - 0 |
|
Buy Now | |
|
DISTI #
2094305
|
Farnell | MCU, 32BIT, CORTEX-M3, 180MHZ, TFBGA-100 RoHS: Compliant Min Qty: 1 Lead time: 14 Weeks, 1 Days Container: Each | 0 |
|
$2.7973 / $3.7464 | Buy Now |
Part Details for LPC1810FET100,551
LPC1810FET100,551 CAD Models
LPC1810FET100,551 Part Data Attributes
|
|
LPC1810FET100,551
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
LPC1810FET100,551
NXP Semiconductors
LPC1810FET100 - High Performance 32-bit Microcontroller based on ARM Cortex-M3 BGA 100-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | SOT926-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 9 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 49 | |
| Number of Terminals | 100 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA100,10X10,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 139264 | |
| ROM (words) | 65536 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 180 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.2 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |