Part Details for LPC1813JET100E by NXP Semiconductors
Overview of LPC1813JET100E by NXP Semiconductors
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Price & Stock for LPC1813JET100E
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
47W6531
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Newark | High Performance 32-Bit Microcontroller Based On Arm Cortex-M3/Tray Rohs Compliant: Yes |Nxp LPC1813JET100E Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$8.4500 / $8.6900 | Buy Now |
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DISTI #
LPC1813JET100E-ND
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DigiKey | IC MCU 32BIT 512KB FLSH 100TFBGA Min Qty: 260 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$10.2192 | Buy Now |
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DISTI #
LPC1813JET100E
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Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC 512KB Flash 3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC1813JET100E) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$7.6972 / $8.8766 | Buy Now |
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DISTI #
771-LPC1813JET100E
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Mouser Electronics | ARM Microcontrollers - MCU 32-bit ARM Cortex-M3 Microcontroller Uni RoHS: Compliant | 0 |
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$10.1500 / $10.1700 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 260 Package Multiple: 260 Container: Tray | 0Tray |
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$8.2800 | Buy Now |
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DISTI #
LPC1813JET100E
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Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC 512KB Flash 3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC1813JET100E) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$7.6972 / $8.8766 | Buy Now |
|
DISTI #
LPC1813JET100E
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Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC 512KB Flash 3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC1813JET100E) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$7.6972 / $8.8766 | Buy Now |
|
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Flip Electronics | Stock | 417 |
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RFQ |
Part Details for LPC1813JET100E
LPC1813JET100E CAD Models
LPC1813JET100E Part Data Attributes
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LPC1813JET100E
NXP Semiconductors
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Datasheet
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LPC1813JET100E
NXP Semiconductors
LPC1813JET100 - High Performance 32-bit Microcontroller based on ARM Cortex-M3 BGA 100-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Pin Count | 100 | |
| Manufacturer Package Code | SOT926-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B100 | |
| Length | 9 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 49 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA100,10X10,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 106496 | |
| ROM (words) | 524288 | |
| ROM Programmability | FLASH | |
| Speed | 180 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.2 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |