Part Details for LPC2132FBD64/CP3252 by NXP Semiconductors
Overview of LPC2132FBD64/CP3252 by NXP Semiconductors
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Part Details for LPC2132FBD64/CP3252
LPC2132FBD64/CP3252 CAD Models
LPC2132FBD64/CP3252 Part Data Attributes:
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LPC2132FBD64/CP3252
NXP Semiconductors
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LPC2132FBD64/CP3252
NXP Semiconductors
IC 32-BIT, FLASH, 60 MHz, RISC MICROCONTROLLER, PQFP64, 10 X 10 MM, 1.40 MM HEIGHT, ROHS COMPLIANT, PLASTIC, MS-026, SOT314-2, LQFP-64, Microcontroller
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFP | |
| Package Description | LFQFP, | |
| Pin Count | 64 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G64 | |
| Length | 10 mm | |
| Number of I/O Lines | 47 | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 60 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |