Part Details for LPC4325JET100 by NXP Semiconductors
Overview of LPC4325JET100 by NXP Semiconductors
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Price & Stock for LPC4325JET100
| Part # | Distributor | Description | Stock | Price | Buy | |
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Flip Electronics | Stock, ship today | 2287 |
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$28.3800 | RFQ |
Part Details for LPC4325JET100
LPC4325JET100 CAD Models
LPC4325JET100 Part Data Attributes
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LPC4325JET100
NXP Semiconductors
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Datasheet
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LPC4325JET100
NXP Semiconductors
32-BIT, FLASH, 204MHz, RISC MICROCONTROLLER, PBGA100, 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B100 | |
| Length | 9 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 49 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 204 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.2 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |