Part Details for LTC4301LCMS8#PBF by Analog Devices Inc
Results Overview of LTC4301LCMS8#PBF by Analog Devices Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Available)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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LTC4301LCMS8#PBF Information
LTC4301LCMS8#PBF by Analog Devices Inc is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for LTC4301LCMS8#PBF
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
50AK3502
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Newark | Hot-Swap Ctrl, 0 To 70Deg C, Msop-8, No. Of Channels:-, Supply Voltage Min:2.7V, Supply Voltage Max:5.5V, Ic Case/Package:Msop, No. Of Pins:8Pins, Power Switch:-, Ic Mounting:Surface Mount, Ic Function:-, Product Range:- Rohs Compliant: Yes |Analog Devices LTC4301LCMS8#PBF RoHS: Not Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 130 |
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$3.5100 / $8.2800 | Buy Now |
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DISTI #
LTC4301LCMS8#PBF-ND
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DigiKey | IC REDRIVER I2C HOTSWAP 8MSOP Min Qty: 1 Lead time: 10 Weeks Container: Tube |
256 In Stock |
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$3.6803 / $6.4800 | Buy Now |
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DISTI #
584-LTC4301LCMS8#PBF
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Mouser Electronics | Interface - Signal Buffers, Repeaters Hot Swappable 2-Wire Bus Buf w/ L V Leve RoHS: Compliant | 93 |
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$3.4100 / $8.0400 | Buy Now |
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Analog Devices Inc | Hot Swappable 2-Wire Bus Buf w Package Multiple: 50 | 52 |
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$2.7300 / $8.0400 | Buy Now |
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DISTI #
88806595
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Verical | I2C Logic Buffer 3.3V/5V 8-Pin MSOP Tube RoHS: Compliant Min Qty: 100 Package Multiple: 100 Date Code: 2438 | Americas - 100 |
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$3.3360 / $3.7510 | Buy Now |
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DISTI #
91730268
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Verical | I2C Logic Buffer 3.3V/5V 8-Pin MSOP Tube RoHS: Compliant Min Qty: 100 Package Multiple: 50 Date Code: 2524 | Americas - 100 |
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$3.3360 / $3.8940 | Buy Now |
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DISTI #
LTC4301LCMS8PBF
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Richardson RFPD | INTERFACE - MISCELLANEOUS RoHS: Compliant Min Qty: 150 | 0 |
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$3.5300 / $3.8700 | Buy Now |
US Tariff Estimator: LTC4301LCMS8#PBF by Analog Devices Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for LTC4301LCMS8#PBF
LTC4301LCMS8#PBF CAD Models
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LTC4301LCMS8#PBF Part Data Attributes
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LTC4301LCMS8#PBF
Analog Devices Inc
Buy Now
Datasheet
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LTC4301LCMS8#PBF
Analog Devices Inc
Bus Buffer, CMOS, PDSO8
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| Pbfree Code | No | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Package Description | Tssop, | |
| Pin Count | 8 | |
| Manufacturer Package Code | 05-08-1660 | |
| Reach Compliance Code | Compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | Bus Buffers | |
| JESD-30 Code | S-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Length | 3 Mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Package Body Material | Plastic/Epoxy | |
| Package Code | TSSOP | |
| Package Shape | Square | |
| Package Style | Small Outline, Thin Profile, Shrink Pitch | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 Mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | Yes | |
| Technology | Cmos | |
| Temperature Grade | Commercial | |
| Terminal Finish | Matte Tin (Sn) - Annealed | |
| Terminal Form | Gull Wing | |
| Terminal Pitch | 0.65 Mm | |
| Terminal Position | Dual | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 3 Mm |
Alternate Parts for LTC4301LCMS8#PBF
This table gives cross-reference parts and alternative options found for LTC4301LCMS8#PBF. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LTC4301LCMS8#PBF, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| LTC4301LIMS8#PBF | Analog Devices Inc | $4.3980 | Bus Buffer, CMOS, PDSO8 | LTC4301LCMS8#PBF vs LTC4301LIMS8#PBF |
LTC4301LCMS8#PBF Frequently Asked Questions (FAQ)
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A good PCB layout for the LTC4301 involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the traces between the IC and the capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
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To ensure reliable hot swap operation, make sure to follow the recommended circuit layout and component selection guidelines, use a suitable hot swap controller, and ensure that the power supply can handle the inrush current during hot swap events.
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When selecting external capacitors for the LTC4301, consider the capacitance value, voltage rating, ESR, and temperature coefficient. Choose capacitors with low ESR and high reliability, and ensure they can handle the maximum voltage and current ratings.
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To troubleshoot issues with the LTC4301, start by checking the power supply voltage, input voltage, and output voltage. Verify that the capacitors are properly selected and installed, and check for any signs of overheating or physical damage. Use an oscilloscope to monitor the voltage and current waveforms.
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The LTC4301 can operate in high-temperature environments, but it's essential to ensure that the device is properly derated and that the PCB is designed to handle the increased temperatures. Use a heat sink or thermal interface material to improve heat dissipation, and consider using a thermally enhanced package.