Datasheets
M27C1024-12XF6 by: STMicroelectronics

64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40

Part Details for M27C1024-12XF6 by STMicroelectronics

Overview of M27C1024-12XF6 by STMicroelectronics

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Applications Computing and Data Storage

Part Details for M27C1024-12XF6

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M27C1024-12XF6 Part Data Attributes:

M27C1024-12XF6 STMicroelectronics
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M27C1024-12XF6 STMicroelectronics 64KX16 UVPROM, 100ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-40
Pin Count 40
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T40
JESD-609 Code e3
Length 52.195 mm
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 16
Number of Functions 1
Number of Terminals 40
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 64KX16
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP40,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.97 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27C1024-12XF6

This table gives cross-reference parts and alternative options found for M27C1024-12XF6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C1024-12XF6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
AM27C1024-125DI UVPROM, 64KX16, 120ns, CMOS, CDIP40, WINDOWED, CERAMIC, DIP-40 AMD M27C1024-12XF6 vs AM27C1024-125DI
TMS27C210A-120JE 64KX16 UVPROM, 120ns, CDIP40, 0.600 INCH, WINDOWED, CERAMIC, DIP-40 Texas Instruments M27C1024-12XF6 vs TMS27C210A-120JE
Part Number Description Manufacturer Compare
AM27C1024-90DI UVPROM, 64KX16, 90ns, CMOS, CDIP40, CERAMIC, DIP-40 AMD M27C1024-12XF6 vs AM27C1024-90DI
AT27HC1024-70DI UVPROM, 64KX16, 70ns, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 Atmel Corporation M27C1024-12XF6 vs AT27HC1024-70DI
5962-8680506XA UVPROM, 64KX16, 90ns, CMOS, CQCC44, CERAMIC, LCC-44 Thales Components Corp M27C1024-12XF6 vs 5962-8680506XA
5962-8680502XC UVPROM, 64KX16, 250ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 Atmel Corporation M27C1024-12XF6 vs 5962-8680502XC
27C1024DESC02XA UVPROM, 64KX16, 200ns, CMOS, CQCC44, CERAMIC, LCC-44 e2v technologies M27C1024-12XF6 vs 27C1024DESC02XA
TMS27C210A-10JL 1 048 576-Bit Programmable Read-Only Memory 40-CDIP Texas Instruments M27C1024-12XF6 vs TMS27C210A-10JL
AM27C1024-170LIB UVPROM, 64KX16, 170ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 AMD M27C1024-12XF6 vs AM27C1024-170LIB
M27C1024-70XF1 64KX16 UVPROM, 70ns, CDIP40, WINDOWED, FRIT SEALED, CERAMIC, DIP-40 STMicroelectronics M27C1024-12XF6 vs M27C1024-70XF1
WS27C210L-12CMB UVPROM, 64KX16, 120ns, CMOS, CQCC44, Waferscale Integration Inc M27C1024-12XF6 vs WS27C210L-12CMB
27C1024MEQ1B/T25 UVPROM, 64KX16, 200ns, CMOS, CQCC44, CERAMIC, LCC-44 e2v technologies M27C1024-12XF6 vs 27C1024MEQ1B/T25

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