Part Details for M2GL060T-FCS325I by Microchip Technology Inc
Results Overview of M2GL060T-FCS325I by Microchip Technology Inc
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (1 replacement)
- Tariff Estimator: (Available) NEW
- Number of Functional Equivalents: (0 options)
- CAD Models: (Request Part)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Computing and Data Storage
M2GL060T-FCS325I Information
M2GL060T-FCS325I by Microchip Technology Inc is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Price & Stock for M2GL060T-FCS325I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
33AJ7956
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Newark | Igloo2 Low Density Fpga, 56.5Kles 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2GL060T-FCS325I RoHS: Compliant Min Qty: 176 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$88.2000 / $95.0700 | Buy Now |
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DISTI #
M2GL060T-FCS325I-ND
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DigiKey | IC FPGA 200 I/O 325BGA Min Qty: 176 Lead time: 14 Weeks Container: Tray | Temporarily Out of Stock |
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$95.0707 | Buy Now |
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DISTI #
M2GL060T-FCS325I
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Avnet Americas | IGLOO 2 - Trays (Alt: M2GL060T-FCS325I) COO: Korea (the Republic of) RoHS: Not Compliant Min Qty: 176 Package Multiple: 176 Lead time: 14 Weeks, 0 Days Container: Tray | 0 |
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$91.5000 / $104.5714 | Buy Now |
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DISTI #
494-M2GL060T-FCS325I
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Mouser Electronics | FPGA - Field Programmable Gate Array IGLOO2 Low Density FPGA, 56.5KLEs RoHS: Not Compliant | 0 |
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$95.0700 | Order Now |
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DISTI #
M2GL060T-FCS325I
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Microchip Technology Inc | IGLOO2 Low Density FPGA, 56.5KLEs, TFBGA, Projected EOL: 2049-02-04 COO: South Korea ECCN: 3A991.d RoHS: Compliant Lead time: 14 Weeks, 0 Days Container: Tray | In Stock: 9 and Alternates Available |
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$56.7400 / $104.5700 | Buy Now |
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Onlinecomponents.com | COO: South Korea RoHS: Compliant | 0 |
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$92.7800 / $272.3000 | Buy Now |
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NAC | IGLOO2 Low Density FPGA, 56.5KLEs. Package: 325 TFBGA 11x11x1.01mm TRAY - FPGA Flash Product Line RoHS: Compliant Min Qty: 1 Package Multiple: 1 Container: Tray | 7 |
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$89.2700 / $104.5700 | Buy Now |
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Chip Stock | IGLOO2LowDensityFPGA,56.5KLEs | 643 |
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RFQ | |
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Master Electronics | COO: South Korea RoHS: Compliant | 0 |
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$92.7800 / $272.3000 | Buy Now |
US Tariff Estimator: M2GL060T-FCS325I by Microchip Technology Inc
Calculations from this tool are estimations only for imports into the United States. Please refer to the distributor or manufacturer and reference official US government sources and authorities to verify any final purchase costs.
Part Details for M2GL060T-FCS325I
M2GL060T-FCS325I Part Data Attributes
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M2GL060T-FCS325I
Microchip Technology Inc
Buy Now
Datasheet
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Compare Parts:
M2GL060T-FCS325I
Microchip Technology Inc
IGLOO2 Low Density FPGA, 56.5KLEs
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Package Description | Bga, Bga325,21x21,20 | |
| Pin Count | 325 | |
| Manufacturer Package Code | TFBGA-325 | |
| Reach Compliance Code | Not Compliant | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 14 Weeks | |
| JESD-30 Code | S-PBGA-B325 | |
| JESD-609 Code | e0 | |
| Length | 11 Mm | |
| Number of Inputs | 200 | |
| Number of Outputs | 200 | |
| Number of Terminals | 325 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | Plastic/Epoxy | |
| Package Code | BGA | |
| Package Equivalence Code | BGA325,21X21,20 | |
| Package Shape | Square | |
| Package Style | Grid Array | |
| Packing Method | Tray | |
| Programmable Logic Type | Field Programmable Gate Array | |
| Seated Height-Max | 1.01 Mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | Yes | |
| Temperature Grade | Industrial | |
| Terminal Finish | Tin/Lead (Sn63pb37) | |
| Terminal Form | Ball | |
| Terminal Pitch | 0.5 Mm | |
| Terminal Position | Bottom | |
| Width | 11 Mm |
Alternate Parts for M2GL060T-FCS325I
This table gives cross-reference parts and alternative options found for M2GL060T-FCS325I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2GL060T-FCS325I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M2GL060T-FCSG325I | Microchip Technology Inc | $111.3590 | IGLOO2 Low Density FPGA, 56.5KLEs | M2GL060T-FCS325I vs M2GL060T-FCSG325I |
M2GL060T-FCS325I Frequently Asked Questions (FAQ)
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Microchip provides a PCB layout guide and reference design files for the M2GL060T-FCS325I, which can be found on their website. It's recommended to follow these guidelines for optimal signal integrity and to minimize electromagnetic interference (EMI).
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The M2GL060T-FCS325I has a built-in POR circuit, but it's recommended to use an external POR circuit to ensure reliable operation. A simple POR circuit can be implemented using a voltage supervisor IC, such as the Microchip MCP112 or MCP113, which can detect the power supply voltage and generate a reset signal.
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The M2GL060T-FCS325I has a complex clock management system, and proper configuration is critical for reliable operation. It's recommended to follow Microchip's guidelines for clock domain crossing, clock frequency planning, and clock skew management. Additionally, using the FPGA's built-in clock wizard tool can help simplify the clock configuration process.
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To optimize power consumption, it's recommended to use the FPGA's power-saving features, such as clock gating, power gating, and dynamic voltage and frequency scaling (DVFS). Additionally, using a low-power FPGA fabric, such as Microchip's eXtreme Low Power (XLP) fabric, can help reduce power consumption. It's also important to optimize the design's clock frequency, voltage, and logic usage to minimize power consumption.
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To ensure reliable and secure boot operations, it's recommended to use a secure boot mechanism, such as Microchip's Secure Boot and Secure Firmware Update (SBU) feature. This feature provides a secure way to boot the FPGA and update the firmware. Additionally, using a secure boot loader, such as the Microchip Bootloader, can help prevent unauthorized access to the FPGA's configuration and firmware.