There are no models available for this part yet.
Overview of M36W832BE100ZA6 by STMicroelectronics
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for M36W832BE100ZA6 by STMicroelectronics
Part Data Attributes for M36W832BE100ZA6 by STMicroelectronics
|
|
|
|---|---|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
STMICROELECTRONICS
|
|
Part Package Code
|
BGA
|
|
Package Description
|
0.80 MM PITCH, STACK, LFBGA-66
|
|
Pin Count
|
66
|
|
Reach Compliance Code
|
not_compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.71
|
|
Access Time-Max
|
100 ns
|
|
Additional Feature
|
ALSO CONTAINS 512K X 16 SRAM
|
|
JESD-30 Code
|
R-PBGA-B66
|
|
JESD-609 Code
|
e0
|
|
Length
|
12 mm
|
|
Memory Density
|
33554432 bit
|
|
Memory IC Type
|
MEMORY CIRCUIT
|
|
Memory Width
|
16
|
|
Mixed Memory Type
|
FLASH+SRAM
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
66
|
|
Number of Words
|
2097152 words
|
|
Number of Words Code
|
2000000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
2MX16
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LFBGA
|
|
Package Equivalence Code
|
BGA66,8X12,32
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Standby Current-Max
|
0.00002 A
|
|
Supply Current-Max
|
0.035 mA
|
|
Supply Voltage-Max (Vsup)
|
3.3 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Width
|
8 mm
|
Alternate Parts for M36W832BE100ZA6
This table gives cross-reference parts and alternative options found for M36W832BE100ZA6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M36W832BE100ZA6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| M36W832BE100ZA1T | SPECIALTY MEMORY CIRCUIT, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | STMicroelectronics | M36W832BE100ZA6 vs M36W832BE100ZA1T |
| M36W832BE100ZA1 | SPECIALTY MEMORY CIRCUIT, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | STMicroelectronics | M36W832BE100ZA6 vs M36W832BE100ZA1 |
| M36W832BE100ZA1 | Memory Circuit, 2MX16, CMOS, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | Numonyx Memory Solutions | M36W832BE100ZA6 vs M36W832BE100ZA1 |
| M36W832BE100ZA6 | Memory Circuit, 2MX16, CMOS, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | Numonyx Memory Solutions | M36W832BE100ZA6 vs M36W832BE100ZA6 |
| M36W832BE100ZA1T | Memory Circuit, 2MX16, CMOS, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | Numonyx Memory Solutions | M36W832BE100ZA6 vs M36W832BE100ZA1T |
| M36W832BE100ZA6T | SPECIALTY MEMORY CIRCUIT, PBGA66, 0.80 MM PITCH, STACK, LFBGA-66 | STMicroelectronics | M36W832BE100ZA6 vs M36W832BE100ZA6T |