Memory
M68AF127BM55B1T
STMicroelectronics
Description: 128KX8 STANDARD SRAM, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Overview of M68AF127BM55B1T by STMicroelectronics

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
  • Distributor Offerings: ( 0 listings )
  • Number of FFF Equivalents: ( 0 replacements )
  • CAD Models: ( Request Part )
  • Number of Functional Equivalents: ( 10 options )
  • Part Data Attributes ( Available )
  • Reference Designs: ( Not Available )
Where used in Applications: Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Entertainment and Gaming Robotics and Drones

CAD Models for M68AF127BM55B1T by STMicroelectronics
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Part Data Attributes for M68AF127BM55B1T by STMicroelectronics

M68AF127BM55B1T
STMicroelectronics
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
Part Package Code
DIP
Package Description
DIP,
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
55 ns
JESD-30 Code
R-PDIP-T32
Length
42.035 mm
Memory Density
1048576 bit
Memory IC Type
STANDARD SRAM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX8
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
4.83 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. M68AF127BM55B1T
    STMicroelectronics
    128KX8 STANDARD SRAM, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
    VS

Alternate Parts for M68AF127BM55B1T

This table gives cross-reference parts and alternative options found for M68AF127BM55B1T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M68AF127BM55B1T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
K6T1008C2E-DB55 Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor M68AF127BM55B1T vs K6T1008C2E-DB55
KM681000CLP-5L Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor M68AF127BM55B1T vs KM681000CLP-5L
V62C5181024L-55P Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Mosel Vitelic Corporation M68AF127BM55B1T vs V62C5181024L-55P
P4C1024-55C6M Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Pyramid Semiconductor Corporation M68AF127BM55B1T vs P4C1024-55C6M
FT8128SMB-55 Standard SRAM, 128KX8, 55ns, CMOS, 0.600 INCH, DIP-32 Force Technologies Ltd M68AF127BM55B1T vs FT8128SMB-55
V62C5181024LL-55P Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Mosel Vitelic Corporation M68AF127BM55B1T vs V62C5181024LL-55P
KM681000ALPI-5L Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, DIP-32 Samsung Semiconductor M68AF127BM55B1T vs KM681000ALPI-5L
DPS128M8AN-55B Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, SIDE BRAZED, CERAMIC, DIP-32 Twilight Technology Inc M68AF127BM55B1T vs DPS128M8AN-55B
IDT71M025S55CM Standard SRAM, 128KX8, 55ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 Integrated Device Technology Inc M68AF127BM55B1T vs IDT71M025S55CM
M5M51008CP-55XI Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Mitsubishi Electric M68AF127BM55B1T vs M5M51008CP-55XI

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