Part Details for M68AF127BM55B6 by STMicroelectronics
Overview of M68AF127BM55B6 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for M68AF127BM55B6
M68AF127BM55B6 CAD Models
M68AF127BM55B6 Part Data Attributes
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M68AF127BM55B6
STMicroelectronics
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Datasheet
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M68AF127BM55B6
STMicroelectronics
128KX8 STANDARD SRAM, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | 0.600 INCH, PLASTIC, DIP-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDIP-T32 | |
| JESD-609 Code | e3 | |
| Length | 42.035 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 4.83 mm | |
| Standby Current-Max | 0.0000045 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M68AF127BM55B6
This table gives cross-reference parts and alternative options found for M68AF127BM55B6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M68AF127BM55B6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| EDI88130CS55CI | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, | Electronic Designs Inc | M68AF127BM55B6 vs EDI88130CS55CI |
| BS62LV1027PCP55 | Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-32 | Brilliance Semiconductor Inc | M68AF127BM55B6 vs BS62LV1027PCP55 |
| M68AF127BL55B6T | 128KX8 STANDARD SRAM, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | STMicroelectronics | M68AF127BM55B6 vs M68AF127BL55B6T |
| WMS128K8L55CC | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | M68AF127BM55B6 vs WMS128K8L55CC |
| HM628128DLP-5 | 128KX8 STANDARD SRAM, 55ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Renesas Electronics Corporation | M68AF127BM55B6 vs HM628128DLP-5 |
| 8959826BXA | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 | Micross Components | M68AF127BM55B6 vs 8959826BXA |
| IDT71M025S55CM | Standard SRAM, 128KX8, 55ns, CDIP32, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | Integrated Device Technology Inc | M68AF127BM55B6 vs IDT71M025S55CM |
| K6T1008C2E-DL55 | Standard SRAM, 128KX8, 55ns, CMOS, PDIP32, 0.600 INCH, DIP-32 | Samsung Semiconductor | M68AF127BM55B6 vs K6T1008C2E-DL55 |
| WMS128K8L55CIA | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32, 0.600 INCH, SINGLE CAVITY, SIDE BRAZED, CERAMIC, DIP-32 | White Electronic Designs Corp | M68AF127BM55B6 vs WMS128K8L55CIA |
| MSM8128SI-55 | Standard SRAM, 128KX8, 55ns, CMOS, CDIP32 | Mosaic Semiconductor Inc | M68AF127BM55B6 vs MSM8128SI-55 |