Part Details for MB91F637ABGL by FUJITSU Semiconductor Limited
Overview of MB91F637ABGL by FUJITSU Semiconductor Limited
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Part Details for MB91F637ABGL
MB91F637ABGL CAD Models
MB91F637ABGL Part Data Attributes
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MB91F637ABGL
FUJITSU Semiconductor Limited
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Datasheet
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MB91F637ABGL
FUJITSU Semiconductor Limited
RISC Microcontroller, 32-Bit, FLASH, 60MHz, CMOS, PBGA144, 12 X 12 MM, 1.45 MM HEIGHT, 0.80 MM PITCH, PLASTIC, PFBGA-144
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Part Package Code | BGA | |
| Package Description | LFBGA, | |
| Pin Count | 144 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| Clock Frequency-Max | 40 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B144 | |
| JESD-609 Code | e0 | |
| Length | 12 mm | |
| Number of I/O Lines | 126 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.45 mm | |
| Speed | 60 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |