Part Details for MBM2764-30-XZ by FUJITSU Limited
Overview of MBM2764-30-XZ by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Part Details for MBM2764-30-XZ
MBM2764-30-XZ CAD Models
MBM2764-30-XZ Part Data Attributes:
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MBM2764-30-XZ
FUJITSU Limited
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Datasheet
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MBM2764-30-XZ
FUJITSU Limited
8KX8 UVPROM, 300ns, CDIP28, CERDIP-28
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Part Package Code | DIP | |
| Package Description | WDIP, | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-GDIP-T28 | |
| Length | 37.275 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.84 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | NMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for MBM2764-30-XZ
This table gives cross-reference parts and alternative options found for MBM2764-30-XZ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM2764-30-XZ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TS27C64A-30XCQ | 8KX8 UVPROM, 300ns, CDIP28, CERAMIC, FDIP-28 | STMicroelectronics | MBM2764-30-XZ vs TS27C64A-30XCQ |
| AM27C64-305DC | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | MBM2764-30-XZ vs AM27C64-305DC |
| M27C64A-30F1X | 8KX8 UVPROM, 300ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | MBM2764-30-XZ vs M27C64A-30F1X |
| AM2764A-30/BXA | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | MBM2764-30-XZ vs AM2764A-30/BXA |
| TMS27C64-30JL | 8KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | MBM2764-30-XZ vs TMS27C64-30JL |
| QD2764A-30 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | MBM2764-30-XZ vs QD2764A-30 |
| QD2764-3 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | MBM2764-30-XZ vs QD2764-3 |
| DQ2764-30 | UVPROM, 8KX8, 300ns, MOS, CDIP28 | LSI Corporation | MBM2764-30-XZ vs DQ2764-30 |
| 27LV64-30I/J | 8K X 8 UVPROM, 300 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | MBM2764-30-XZ vs 27LV64-30I/J |
| 27LV64-30/J | 8K X 8 UVPROM, 300 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | MBM2764-30-XZ vs 27LV64-30/J |