Part Details for MBM27C4000-15XZ by FUJITSU Limited
Overview of MBM27C4000-15XZ by FUJITSU Limited
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Industrial Automation
Computing and Data Storage
Financial Technology (Fintech)
Aerospace and Defense
Telecommunications
Renewable Energy
Robotics and Drones
Part Details for MBM27C4000-15XZ
MBM27C4000-15XZ CAD Models
MBM27C4000-15XZ Part Data Attributes
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MBM27C4000-15XZ
FUJITSU Limited
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Datasheet
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MBM27C4000-15XZ
FUJITSU Limited
EPROM, 512KX8, 150ns, CMOS, CDIP32
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| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | FUJITSU LTD | |
| Package Description | DIP, DIP32,.6 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 150 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-XDIP-T32 | |
| JESD-609 Code | e0 | |
| Memory Density | 4194304 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 512KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | DIP | |
| Package Equivalence Code | DIP32,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |
Alternate Parts for MBM27C4000-15XZ
This table gives cross-reference parts and alternative options found for MBM27C4000-15XZ. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM27C4000-15XZ, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MX27C4100MC-90 | OTP ROM, 512KX8, 90ns, CMOS, PDSO40, PLASTIC, SOP-40 | Macronix International Co Ltd | MBM27C4000-15XZ vs MX27C4100MC-90 |
| CY27C64-150JC | OTP ROM, 8KX8, 150ns, CMOS, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | MBM27C4000-15XZ vs CY27C64-150JC |
| HY27UH08AG5BTC | Flash, 2GX8, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | SK Hynix Inc | MBM27C4000-15XZ vs HY27UH08AG5BTC |
| MX23C2000PC-70 | MASK ROM, 256KX8, 70ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 | Macronix International Co Ltd | MBM27C4000-15XZ vs MX23C2000PC-70 |
| AM27C64-200DEB | UVPROM, 8KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | MBM27C4000-15XZ vs AM27C64-200DEB |
| CAT28C64BPI-90 | 8KX8 EEPROM 5V, 90ns, PDIP28, PLASTIC, DIP-28 | onsemi | MBM27C4000-15XZ vs CAT28C64BPI-90 |
| M27V512-200F6 | 64KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | STMicroelectronics | MBM27C4000-15XZ vs M27V512-200F6 |
| AM28F010-150FEB | Flash, 128KX8, 150ns, PDSO32, REVERSE, TSOP-32 | Rochester Electronics LLC | MBM27C4000-15XZ vs AM28F010-150FEB |
| W27C020PM-12 | EEPROM, 256KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | Winbond Electronics Corp | MBM27C4000-15XZ vs W27C020PM-12 |
| AT27LV512A-55JU | OTP ROM, 64KX8, 55ns, CMOS, PQCC32, GREEN, PLASTIC, MS-016AE, LCC-32 | Atmel Corporation | MBM27C4000-15XZ vs AT27LV512A-55JU |